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| Passives |
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(Product News,
Jul 2006 )
Analog Switches Support for Basestation Test Set Pre-integrated Software Packages Bluetooth Test Instrument WCDMA Power Amplifiers Power-management Interface Radio Chip Development Kit Thick-film .... |
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(Product News,
30 Jun 2006 )
ProtectStar has launched the Mobile Firewall for appliances with Windows Mobile operating system "ProtectStar Mobile Firewall. Suited for pocket PCs, handhelds, and smartphones with Windows Mobile OS, .... |
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(Product News,
20 Jun 2006 )
Freescale Semiconductor has introduced its 2 GHz high-power RF transistors housed in over-molded plastic packages that deliver performance comparable to air-cavity flange packages. The advanced devices .... |
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(Product News,
02 Jun 2006 )
Fox Electronics has introduced a 3.3V, HCMOS ceramic surface mount oscillator that features a small form factor and low power consumption. The HCMOS Model F230 requires 7 mA at 12 MHz and 5 µA during .... |
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(Product News,
31 May 2006 )
Huawei Technologies has unveiled a super-large capacity Gigabit Passive Optical Network (GPON) solution with up to 1 Terabit switching capacity at IEC's Broadband World Forum Asia 2006. Aimed at helping .... |
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(Business News & Technology News,
29 May 2006 )
Andrew Corporation has introduced its ValuStar line of low cost, premium quality all-steel antennas for the direct-to-home (DTH) and receive-only very small aperture terminal (VSAT) markets. The ValuStar .... |
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(Product News,
25 May 2006 )
OMRON will be launching an SMD Polymeric Antenna for short-range, wireless Ultra-Wideband (UWB) applications. Driven by consumer demand for simple wireless functionality, "point-and-shoot" usability and .... |
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(Product News,
08 May 2006 )
CSI's Hemisphere GPS division has introduced its Crescent A100 "smart antenna" that combines a GPS antenna with a GPS receiver featuring Hemisphere's new high-performance Crescent OEM module. The entire .... |
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(Product News,
03 May 2006 )
EPCOS now offers SAW filters and two-port resonators as SMDs in ceramic packages on quartz substrate with a footprint of 3 × 3 mm. This represents a reduction in area of 40 % against the previous package’s .... |
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