|
| |
|
|
| |
|
|
| |
 |
|
| |
|
| Passives |
|
|
|
| |
|
 |
(Product News,
28 Feb 2006 )
Murata Electronics North America has introduced a miniature high-frequency wire wound type chip coil (LQW04A series). Measuring 0.8 x 0.4 mm, 03015 EIA sized Series LQW04A features inductance from 1.1-22 .... |
| |
|
|
(Others,
06 Jan 2006 )
The UAB 226G Bicone Antenna from Fractal Antenna Systems provides extreme wideband and omnidirectional performance for signal gathering and high power transmission. This antenna is about one-quarter .... |
| |
|
|
(Top News,
05 Dec 2005 )
WiSpry Inc., a developer of low-cost, high-performance RF-MEMS tunable components and modules for the wireless industry, and Jazz Semiconductor, an independent wafer foundry focused on specialty CMOS .... |
| |
|
|
(Product News,
01 Dec 2005 )
SaRonix recently announced the production release of its NKS3 product series, a quartz crystal resonator contained in an ultra-miniature 3.2 x 2.5 mm package. This new crystal, manufactured at Pericom's .... |
| |
|
|
(Top News,
28 Nov 2005 )
Avnet Electronics Marketing, the largest operating group of Avnet Inc., has joined forces with Freescale Semiconductor to help Chinese consumer electronics manufacturers compete in an increasingly crowded .... |
| |
|
|
(Others,
23 Nov 2005 )
Stats ChipPAC Ltd has qualified a copper process for integrated passive devices (IPD) that delivers superior performance and miniaturization in RF wireless systems. In the wireless market where there .... |
| |
|
|
(Product News,
18 Oct 2005 )
FDK Corp. is sampling the AMF1005L series, claimed to be world's most compact multilayer low-pass filters for GSM mobile phones. The AMF1005L series' dimensions of only 1.0 x 0.5 x 0.3 mm was realized .... |
| |
|
|
(Business News & Technology News,
17 Oct 2005 )
Tegal Corp. recently announced that a major European integrated device manufacturer had placed an order for three additional new 6540 advanced plasma etch systems, valued at over $7.5 million. The 6540 .... |
| |
|
|
(Others,
12 Oct 2005 )
Geneva-based STMicroelectronics recently gave the first details of a breakthrough technology that significantly increases junction capacitance density in thin-film passive integration and extends the .... |
| |
|
| |
Previous
9
[10]
11
12
13
14
Next
|
| |
|
|
|
| |
|
|
| |
|
|
| |
|
|
| |
|
|
|
|
|
|
|
| |
|
|
|
|
