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Wednesday, October 8, 2008 
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Driver Amplifiers Designed for 18GHz to 33GHz Frequencies

(Product News, 13 Aug 2008 )

Avago Technologies has launched AMMC/P-6333, a highly efficient, linear power amplifier targeted at the 18GHz to 33GHz frequency ranges. The AMMC/P-6333 is a high performance driver amplifier with very ....

   

Altera FPGA Development Board Enables Cost, Lab Space, and Power Consumption Reduction

(Product News, 12 Aug 2008 )

XLoom Communications is leveraging Altera Corp.'s Stratix II GX FPGA signal integrity development kit to provide a unique bit error rate (BER) testing environment. Altera's FPGA-based development board ....

   

Atmel Supports Digital Broadcasting Information Service at Beijing Olympics 2008

(Product News, 12 Aug 2008 )

Atmel Corp. is supporting a new text-based information service for digital broadcasting, called Journaline, which will be integrated into several shuttle vehicles at the 2008 Summer Olympics in China. ....

   

ITC Judge Finds that SiRF Infringes Six Broadcom GPS Patents

(Business News & Technology News, 12 Aug 2008 )

A U.S. International Trade Commission (ITC) judge has ruled that products of SiRF Technology Holdings Inc. infringe six patents related to improving global positioning system (GPS) processing and sensitivity. ....

   

Digi-Key Notes Success of Its PTM...Online, On Demand Training Modules

(Business News & Technology News, 12 Aug 2008 )

When Digi-Key Corp. introduced its exclusive PTM...Online, On Demand product training modules in June 2006, it was with the promise that its modest collection of 15 training modules was only the beginning ....

   

Miniaturized Encoder/decoder for Infrared Wireless Communication Measures 4x4x0.75mm

(Product News, 12 Aug 2008 )

Vishay Intertechnology Inc. has released TOIM5232, a new miniaturized encoder/decoder for serial infrared (IrDA) wireless communication. The new device provides proper pulse shaping of RS-232 data signals ....

   

STMicroelectronics, STATS ChipPAC and Infineon Partner on Developing Wafer-Level-Packaging Technology

(Business News & Technology News, 12 Aug 2008 )

STMicroelectronics, STATS ChipPAC and Infineon Technologies AG have signed an agreement to jointly develop the next-generation of embedded Wafer-Level Ball Grid Array (eWLB) technology, based on Infineon's ....

   

Ralink's Latest Wi-Fi 802.11n Solutions Support Next-gen AMD Notebook Platform

(Product News, 11 Aug 2008 )

Ralink Technology has launched two new PCIe interface chipsets that support the next-generation AMD notebook platform. Designed to take maximum advantage of the wireless connectivity and overall system ....

   

Vishay Launches Industry-first Solid Tantalum Chip Capacitor

(Product News, 11 Aug 2008 )

Vishay Intertechnology Inc. has extended its TANTAMOUNT Hi-Rel COTS T97 series to offer the industry's first solid tantalum chip capacitor that has a 63V rating and is designed for derating requirements ....

   
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