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(Product News,
10 Nov 2008 )
Laird Technologies Inc.¡¯s LI0201, the latest line of EIA 0201 ferrite chip beads from the company, extends the existing 0402 to 3312 surface-mounted monolithic EMI suppression product families. The LI0201 .... |
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(Business News & Technology News,
07 Nov 2008 )
ST-NXP Wireless has announced that substantial changes in the global markets and in the needs of its customers have moved the company to accelerate the capturing of synergies it identified in some countries .... |
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(Business News & Technology News,
07 Nov 2008 )
Beijing Tianyu Communication Equipment Co. is increasing the number of handset designs leveraging mobile TV technology from Telegent Systems to drive growth into the Southeast Asia market and capitalize .... |
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(Product News,
06 Nov 2008 )
Xilinx Inc. is now shipping the Virtex-5 SX240T and FX200T devices and has announced the new Virtex-5 TXT FPGA platform. All built on the high-performance Virtex-5 FPGA architecture, these devices give .... |
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(Business News & Technology News,
06 Nov 2008 )
The economic crisis is having a significant impact on the semiconductor industry, as worldwide semiconductor revenue growth in 2009 is expected to be 1 percent, down by approximately 7 percentage points .... |
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(Product News,
06 Nov 2008 )
Fujitsu Microelectronics Asia Pte Ltd (FMAL) has announced two LSIs to expand its line-up of H.264 CODEC LSIs, which encode and decode Full HD (1,920 dots x 1,080 lines) video in the H.264 format. The .... |
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(Business News & Technology News,
06 Nov 2008 )
STMicroelectronics (ST) and LG Electronics (LG) have announced an NFC (Near Field Communication) demonstration of LG's KU380-NFC phone, which uses ST's ST21NFCA system-on-chip. The KU380-NFC phone, which .... |
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(Top News,
06 Nov 2008 )
Over the last several years, the market for Wi-Fi chipsets (primary components, excluding power amplifiers, LNAs and other external components) is expected to deliver revenues of nearly $3 billion in .... |
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(Business News & Technology News,
05 Nov 2008 )
Infineon Technologies AG and Micron Technology Inc. will collaborate on the development of high-density subscriber identity module (HD-SIM) cards reaching beyond 128MB. HD-SIMs are ideal for delivering .... |
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