Click to navigate back to homepage  
Thursday, March 18, 2010 
  Search :



 
     
     
Product News
   

Multilayer Ceramic Chip Coil

(16 Oct 2006)

TDK Corporation has announced the development of the MLG0402 series of chip coils. The coils have approximately 70 percent less volume and 55 percent less mounting area than the 0603-sized coils currently ....
   

Nokia Unveils Nokia Flexi Wimax Base Station

(16 Oct 2006)

Mobile device manufacturer Nokia has unveiled the Nokia Flexi WiMAX Base Station, a compact, light weight base that reduces the amount of space and power consumed to run WiMax networks. The Nokia Flexi ....
   

Mitsubishi Unveils Switchable Power Amplifier Module

(16 Oct 2006)

Mitsubishi Electric has developed an Ingap HBT1 switchable power amplifier for WCDMA used in mobile handset terminals. The amplifier module reportedly shows improved efficiency at low to mid power output, ....
   

3 Australia Releases Sony Ericsson Z610i

(16 Oct 2006)

3 Australia has announced the availability of the Sony Ericsson Z610i in Rose Pink. The company informed that the model is also available in Luster Black and will launch an Airy Blue model in November. ....
   

Tata Elxsi, DiBcom Provide Mobile TV Products

(13 Oct 2006)

Tata Elxsi and DiBcom have announced a partnership to help their customers in realizing innovative mobile TV Products. Tata Elxsi has developed a full DVB-H stack, compliant with the DVB-CBMS specifications. ....
   

Samsung SCH-B600 with 10-Megapixel Camera

(13 Oct 2006)

Samsung has released 10 megapixel mobile phone, SCH-B600. Samsung's 10 megapixel camera phone (SCH-B600) is 6mm thinner and 10g lighter than the 7 megapixel camera phone (SCH-V770) and sets itself apart ....
   

Microchip Announces 8-bit Microcontrollers

(13 Oct 2006)

Microchip Technology has announced a family of smallest 8-bit microcontrollers with an integrated IEEE 802.3-compliant Ethernet communications peripheral. The PIC18F97J60 family is optimised for embedded ....
   

GE Plastics’ Lexan DMX Polycarbonate Resins for Electronic Apps

(13 Oct 2006)

The keypads, housings, and other wear parts for mobile phones, computers, and digital cameras can take a real beating from constant handling. Although polycarbonate (PC) is a favorite choice for these ....
   

Cypress Unveils Capacitive Sensing Family of PSoC

(12 Oct 2006)

Cypress Semiconductor has introduced a family of PSoC (Programmable System-on-Chip) devices optimized for use in capacitive sensing interface applications. The new CapSense devices deliver 45X better ....
   

Mio Brings Style with DigiWalker C310

(12 Oct 2006)

Mio Technology has announced its Mio DigiWalker C310, a portable GPS device to meet growing consumer demand for more personalized navigation that maps to their lifestyle. The Mio DigiWalker C310 comes ....
   
  Previous   [297]    298    299    300    301    302    303    304    Next
   
 
   
   
 
 
         
 
Top News
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Anritsu Intros First Bluetooth Low Energy Test Solution

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Motorola Leads Fast-rebounding WiMAX Equipment and Device Market
   
 
 
Business News & Technology News
   

Broadcom Crystal HD Technology Brings HD Multimedia Experience to Atom-based Netbook Platforms

MobGold Raises $12M Led by Fast Global Investments in Series B Financing

World's Largest PND Makers Integrate Siano's MDTV Receiver Chip Technology

Intel Atom Integrates Graphics, Memory Controller for Netbooks

STMicroelectronics Receives EuroDOCSIS 2.0 Certification for Set-top Box Reference Design
   
 
 
     
 
 
 
     
     
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
     
 
 
 
 
         

 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols
 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.