Click to navigate back to homepage  
Sunday, March 14, 2010 
  Search :



 
     
     
Product News
   

Truphone supports latest Nokia Wi-Fi-equipped handsets

(13 Feb 2007)

Truphone's mobile VoIP service is supported on Nokia's three new handsets: the Wi-Fi-equipped Nokia E61i, Nokia E65 and Nokia E90 models. Truphone enables Wi-Fi-equipped mobile phones to make internet-rate ....
   

Wavesat's Panther designed for 802.16e mobile WiMAX

(13 Feb 2007)

Wavesat strengthened its grip on the WiMAX space by announcing the release of its IEEE 802.16e Mobile WiMAX strategy, centered on its UMobile family of WiMAX chipsets supporting all features of Mobile ....
   

Infineon develops silicon-based low noise amplifiers for UMTS/HSxPA and WLAN applications

(13 Feb 2007)

Infineon Technologies has launched what it claims to be the world’s first commercial silicon-based low noise amplifier (LNA) products that offer better performance-price ratio compared to Gallium Arsenide ....
   

Agilent Technologies launches integrated mobile WiMAX test set

(13 Feb 2007)

Agilent Technologies Inc.'s E6651A Mobile WiMAX Test Set enables designers and manufacturers to accelerate time-to-market for their IEEE802.16e subscriber products. Created in conjunction with Innowireless ....
   

Aeroflex launches W-CDMA ACE 3G protocol analysis test system

(13 Feb 2007)

Aeroflex has launched the W-CDMA ACE 3G protocol analysis test system—a network emulator designed for integration and regression testing of W-CDMA mobile devices. Complementing Aeroflex’s 6401 AIME/CT ....
   

SKY MobileMedia announces pre-integrated handsets

(13 Feb 2007)

SKY MobileMedia Inc. has announced pre-integration of the SKY-MAP Mobile Applications Software Platform with TI's "LoCosto" TCS2300 GSM single chip for ultra low-cost (ULC) handsets. Building upon the ....
   

High speed SRAM for networking, telecom and automotive apps

(13 Feb 2007)

Integrated Silicon Solution has introduced its 16Mb, 1M × 16 high speed/low power asynchronous SRAM with access times of 8ns. This device gives the designer a high speed device that uses low power technology ....
   

Nokia selects single-chip from Infineon for mobile phones

(13 Feb 2007)

Infineon Technologies has announced that Nokia has selected Infineon as a supplier of baseband and RF (radio frequency) chips for GSM mobile handsets. The highly integrated single-chip E-GOLD voice will ....
   

Automotive linear regulator from Maxim with adjustable reset

(13 Feb 2007)

Maxim Integrated Products’ MAX5091 low-quiescent-current, low-dropout (LDO) linear regulator with a wide operating input-voltage range of 5V to 40V has the capability to withstand up to 40V transients. ....
   

Ericsson launches HSPA embedded module for mobile broadband mass market

(12 Feb 2007)

To further strengthen its position in the broadband market, Ericsson is moving to bring HSPA to every new notebook, fixed wireless terminal and any other device where 3G can replace ADSL. The company ....
   
  Previous   257    258    259    260    261    262    [263]    264    Next
   
 
   
   
 
 
         
 
Top News
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Anritsu Intros First Bluetooth Low Energy Test Solution

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Motorola Leads Fast-rebounding WiMAX Equipment and Device Market
   
 
 
Business News & Technology News
   

Broadcom Crystal HD Technology Brings HD Multimedia Experience to Atom-based Netbook Platforms

MobGold Raises $12M Led by Fast Global Investments in Series B Financing

World's Largest PND Makers Integrate Siano's MDTV Receiver Chip Technology

Intel Atom Integrates Graphics, Memory Controller for Netbooks

STMicroelectronics Receives EuroDOCSIS 2.0 Certification for Set-top Box Reference Design
   
 
 
     
 
 
 
     
     
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
     
 
 
 
 
         

 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols
 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.