Click to navigate back to homepage
Friday, January 9, 2009 
  Search :



 
     
     
Product News
   

Miniaturized Encoder/decoder for Infrared Wireless Communication Measures 4x4x0.75mm

(12 Aug 2008)

Vishay Intertechnology Inc. has released TOIM5232, a new miniaturized encoder/decoder for serial infrared (IrDA) wireless communication. The new device provides proper pulse shaping of RS-232 data signals ....

   

IIJ Releases IIJ Mobile Secure Link

(11 Aug 2008)

Internet Initiative Japan Inc. (IIJ), one of Japan's leading Internet access and comprehensive network solutions providers, has released IIJ Mobile Secure Link, a free network connection tool for 3.5G ....

   

Ralink's Latest Wi-Fi 802.11n Solutions Support Next-gen AMD Notebook Platform

(11 Aug 2008)

Ralink Technology has launched two new PCIe interface chipsets that support the next-generation AMD notebook platform. Designed to take maximum advantage of the wireless connectivity and overall system ....

   

Vishay Launches Industry-first Solid Tantalum Chip Capacitor

(11 Aug 2008)

Vishay Intertechnology Inc. has extended its TANTAMOUNT Hi-Rel COTS T97 series to offer the industry's first solid tantalum chip capacitor that has a 63V rating and is designed for derating requirements ....

   

Texas Instruments Releases Next-generation DDR Termination Regulator

(11 Aug 2008)

Texas Instruments Inc. (TI) has launched a sink/source double data rate (DDR) termination regulator that supports all power management requirements for DDR, DDR2, DDR3 and DDR4 low-power memory termination. ....

   

Juniper Networks Enhances Comprehensive Standards-based Access Control Solution

(8 Aug 2008)

Juniper Networks Inc. has launched the next generation of its comprehensive, standards-based Unified Access Control (UAC) 2.2 software, Infranet Controller 4500 (IC 4500) and Infranet Controller 6500 ....

   

GSM/GPRS Module Optimized for M2M Applications

(8 Aug 2008)

iWOW Connections has launched the TR-900 GSM/GPRS module, a new member of the iWOW Wireless Connectivity Module family. Utilizing Texas Instruments Inc.'s LoCosto platform, the TR-900 provides enhanced ....

   

Configuration Tool Targeted at Fiber-optic Networks

(6 Aug 2008)

Aspen Optics is launching a configuration tool for system integrators (SI) and internet service providers (ISP) to generate solutions for fiber network connection. Capable of giving instant recommendations ....

   

Axesstel Launches HSUPA Mini ExpressCard

(6 Aug 2008)

Axesstel Inc. has released the EU230 HSUPA Mini ExpressCard/34 for High-Speed Uplink Packet Access (HSUPA) networks. The EU230 Mini Card enables mobile broadband access to advanced HSUPA networks from ....

   

National Instruments Introduces 6.6GHz PXI Express RF Vector Signal Analyzer and Vector Signal Generator

(6 Aug 2008)

National Instruments has launched a new RF vector signal analyzer, RF vector signal generator and PXI Express 18-slot chassis that offer flexible RF measurements up to 10 times faster than traditional ....

   
  Previous   17    18    19    [20]    21    22    23    24    Next
   
 
   
   
 
 
         
 
Top News
   

3G+ Handsets, Smartphones and Cellular Modems to Keep the Mobile Device Market Ticking Over in 2009

ECS EliteGroup Demos First Dual-mode Mobile WiMAX/EDGE Device

Emerging Markets and Data will Drive Global Mobile Growth to 2013

China Approves 3G Licenses

China's Handset Industry Growth Slowed Down in 2H08

   
 
 
Business News & Technology News
   

Mouser Electronics and Hirose Electric Sign Distribution Agreement

3G Licences Coming to China and India

IP Contact Center Market Up 37%, UC Market Mixed in 2008

Parks Associates Forecasts 4.5B Mobile Phone Users Worldwide by 2013

ON Semiconductor Names M.K. Mak Regional Vice President

   
 
 
     
 
 
     
     
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
     
 
 
         

 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 

Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2009 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.