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(6 Aug 2008)
By Stephen Las Marias, Editor eAsic Corp. has launched its next generation Nextreme-2 Family, which is claimed to be the semiconductor industry's first 45nm, zero mask-charge ASICs. Manufactured on Chartered .... |
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(5 Aug 2008)
The Mobile Internet Devices (MID) market is likely to be the first real example of a greenfield situation in which all mobile operating systems start on the same equal footing, without the baggage of .... |
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(4 Aug 2008)
Qualcomm Inc. has completed what is said to be the world's first data call using High-Speed Packet Access Plus (HSPA+) network technology, also known as HSPA Evolved. The call achieved a data transfer .... |
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(1 Aug 2008)
In the second quarter of 2008, Tier One handset vendors enjoyed year-over-year unit shipment growth of between 15 percent and 22 percent. ABI Research estimates that 301 million units were shipped during .... |
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(31 Jul 2008)
Wireless broadband services will create significant opportunities for revenue growth, and cellular technologies will take the largest share, according to the latest report from Analysys Mason. Globally, .... |
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(30 Jul 2008)
The WLAN and the Bluetooth semiconductor markets continued to post double digit growth in 2007, driven by strong demand for connected devices and new applications. In newly released forecasts for the .... |
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(29 Jul 2008)
NXP and STMicroelectronics have closed their deal to combine their wireless operations into ST-NXP Wireless. The joint venture, which will start operations on August 2nd, launches as a solid top-three .... |
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(28 Jul 2008)
Worldwide service provider capex (capital expenditures) totaled $248.8 billion in 2007, up 7 percent from 2006, according to market researcher Infonetics Research. According to Infonetics' report, "Service .... |
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(25 Jul 2008)
Nokia Corp. and Qualcomm Inc. have entered into a new agreement covering various standards including GSM, EDGE, CDMA, WCDMA, HSDPA, OFDM, WiMAX, LTE and other technologies. The agreement will result in .... |
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(24 Jul 2008)
Wireless USB (WUSB) is currently hampered by the high price of the underlying UWB silicon. According to market research firm In-Stat, this is expected to limit its appeal until prices fall substantially. .... |
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