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Flying Prober for Reverse Engineering
Bernd Hauptmann, General Manager, Seica Germany
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Combo Chips Pack a Punch
Christopher Bergey, Director, Embedded WLAN Business, Broadcom Corp.
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What You Need to Know about WLAN Security
Motorola Inc.
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Rapid Route to Revenues: The Case for EoP
Gil Epshtein, Product Marketing Manager, ECI Telecom
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Conformance Testing of LTE User Equipment
Sandy Fraser, Agilent Technologies
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FEM Enables Direct-to-Battery Operation
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Fuel Gauge ICs Enable ‘Highest’ Capacity Measurement
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Broadband Miniature Variable Attenuator Provides Great Linearity
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Upconverting Mixer Supports All LTE/Cellular Bands
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Transceiver Integrates ±70V Fault Protection
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Pipeline ADC Offers ‘Smallest’ Footprint
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Test Software Accelerates ZigBee Time-to-market
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Regulator Significantly Boosts Battery Lifetime
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Chargers Solve “Dead” Battery Problems
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Low Profile Connector for Handheld
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One-Button Test for 10GBASE-T Accelerates Validation Cycles
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Revolutionary Broadband Wireless Technology
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‘Smallest’ PIFA Ceramic Antenna Enables Superior Signal Transmission
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‘First’ 45nm Combo Solution Enables Superior Connectivity on Mobile Handsets
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FMC: Crossing Hurdles Before Take Off
Kirtimaya Varma
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Huawei Leads Asia’s LTE Development
Stephen Las Marias, Group Online Editor
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No One Escapes Supply and Demand
Allen Nogee, Principal Analyst, In-Stat
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Technology Leaders Under Fire
Jim McGregor, Chief Technology Strategist, In-Stat
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The Smart Enabler Role is a Tough Call for Mobile Operators
Ovum
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