Infineon and Micron to Develop Next-generation Data Storage Solution for HD-SIM Cards

(Business News & Technology News, 5 Nov 2008)

Infineon Technologies AG and Micron Technology Inc. will collaborate on the development of high-density subscriber identity module (HD-SIM) cards reaching beyond 128MB.

HD-SIMs are ideal for delivering expanded storage and greater services while improving the operator's processes. Combining high density with improved security functionality enables operators to offer graphically-rich, value-added services such as mobile banking and contactless mobile ticketing. Further, operators can securely update or delete applications through their wireless network while new applications, services and settings can be downloaded or pushed to the HD-SIM at any time to maintain fast time-to-market. However, this growth in functionality also means that storage solutions for the SIM need to keep evolving to take advantage of faster processing and communication speeds, ultimately delivering the higher memory capacity that these applications require.

To answer these needs, Infineon and Micron will develop an innovative, high-density solution. Working in close technical collaboration, both companies are leveraging their respective expertise to architect modular chip solutions that combine an Infineon security microcontroller with Micron's innovative NAND flash memory with features designed specifically for HD-SIM applications. Micron will manufacture the NAND on 50nm and 34nm process technology. The joint solution is designed to be efficiently integrated into HD-SIM cards and will enable these cards to effectively reach beyond 128MB of capacity and offer a host of other new features, including:

• High density
Serial NAND Flash memory provides the most cost-effective solution for 128MB or greater capacity on HD-SIMs.

• ECC (error correction codes) circuits
Incorporated internally on the Micron NAND to relieve the data error correction burden from the HD-SIM microcontroller and streamline the overall security design.

• Superior Power Management
Designed for European Telecommunications Standards Institute (ETSI) compliance. The Infineon/Micron HD-SIM solution operates across the voltage range of 1.8V to 3.3V complying with ETSI's recommendations for low-operating current.

• Easy Migration
The security microcontroller concept includes an optimized and cost effective packaging solution allowing for easy migration between NOR- and NAND-based technologies as it features an aligned application protocol interface (API) and related software stack. Also, operating system software developed for existing SIM cards can be easily reused.

"The demands for more robust storage and applications are driving the mobile market into its next phase," says Bill Lauer, Senior Director of Marketing at Micron Technology. "Micron is renowned for world-class technology and NAND innovation—we're committed to developing strategic storage solutions that are well past a one-size-fits-all model. This joint HD-SIM solution we are developing together with Infineon provides much greater densities than were available before and we believe this technology will continue to enable new and exciting applications for the mobile market."

"Infineon envisions a new role of future SIM cards that will be capable of audio and video mass content storage and even Flash card replacement. Infineon is committed to enabling the entire HD-SIM market with a comprehensive HD-SIM product portfolio from single-digit megabytes to 2 gigabytes that offers the right level of performance and security," says Dr. Helmut Gassel, Vice President and General Manager of the Chip Card and Security division at Infineon Technologies. "Our customers—chip card manufacturers and mobile network operators alike—benefit from our intelligent HD-SIM microcontroller family concept enabling comfortable migration between NOR- and NAND-based technologies, limited R&D cost and minimized qualification effort for the HD-SIM platform. And that results in their high flexibility in the emerging HD-SIM market allowing fast reaction in multiple use cases."

Prototypes are expected to be available in fall of 2009 and will be sold in die form or in an economic chip card IC package.

Click here for more information on Infineon's product portfolio of chip cards and security ICs

Click here for more information on Micron's memory product portfolio

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