Click to navigate back to homepage
Tuesday, December 2, 2008 
  Search :



 
 
     
 
 
Product News > Sep 2008
 
 

Texas Instruments Releases Contactless Chip for Micropayment, ID Applications

(Product News, 16 Sep 2008)


Texas Instruments Inc. (TI) has launched a new secure multi-purpose contactless chip designed for the growing closed-loop contactless micropayment, loyalty, ID and access application markets. TI's new ISO/IEC 14443 Type B chip—the RF-HCT-WRC5-KP221—combines processing speed, advanced radio frequency (RF) performance and industry-standard security with a flexible and configurable memory that supports up to five applications on one contactless card or token.

A number of closed-loop applications, particularly in Asia and in Central and South America, are seeking the speed, convenience and security of the ISO/IEC 14443 standards-based contactless technology that TI's secure multi-purpose chip provides. These applications, which include private label payment and loyalty/membership programs, closed-loop micropayments, secure ID and corporate access control, can be implemented individually or in combination on the same card or token. For example, a retailer could implement customer payment and loyalty, or a university campus may want to combine building access, payment and secure student and employee ID.

TI's secure contactless chip incorporates a number of security features to provide data privacy in sensitive applications and to protect against cloning and replay attacks. Dynamic encryption is achieved using National Institute of Standards and Technology-approved Triple DES and SHA-1 crypto-algorithms as well as an ANSI X9.63 based session key security. A 128-bit unique session key is generated for each transaction, and the communication between the tag and reader can be encrypted to provide a high-level of confidentiality. The TI product also allows the tag and reader to mutually authenticate each other during every communication session, thus only a trusted tag and reader are authorized to complete a transaction.

Click here for more information on the device

Click here for more information on Texas Instruments' contactless solutions

Click here for more information on Texas Instruments

 
 
 
 
Related Articles
   

Texas Instruments Tops New Mobile Internet Device Platform Vendor Matrix Ranking

Phonak and NXP Develop New Ultra Low Power Wireless Communication Technology

STMicroelectronics' Power-line Transceivers to be Deployed in Automatic Meter Reading Project in China

Power Integrations' LinkSwitch-II Delivers Five-star Rating for Cellphone-charger Power Consumption

Wireless Network Traffic to Increase Tenfold

ITU advocates infrastructure sharing to counter investment drought

STMicroelectronics Updates 4Q08 Outlook

Xilinx Automotive Optical Flow Solution Targeted at Advanced Driver Assistance Systems

NXP Launches LDMOS Transistor for L-band Radar Applications

Fairchild Semiconductor Receives China Excellent Supplier Award from CEEA

   
 
Top News
   

Phonak and NXP Develop New Ultra Low Power Wireless Communication Technology

Wireless Network Traffic to Increase Tenfold

CDMA Subscriber Base Reaches 475 Million Worldwide

Avago Technologies Complete GPS RF Front End Module with FBAR Filters Simplifies GPS Designs

CMTS Market Dropped 32% in 3Q08

   
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 

Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2008 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.