Click to navigate back to homepage
Wednesday, December 3, 2008 
  Search :



 
 
     
 
 
Top News > Aug 2008
 
 

Qualcomm Achieves World's First HSPA+ Data Call

(Top News, 4 Aug 2008)


Qualcomm Inc. has completed what is said to be the world's first data call using High-Speed Packet Access Plus (HSPA+) network technology, also known as HSPA Evolved. The call achieved a data transfer rate of more than 20Mbps in a 5MHz channel. HSPA+ will allow operators to double the data and triple the voice capacity of their networks compared to current HSPA deployments. The successful data throughput was achieved on Qualcomm's MDM8200, the industry's first chipset solution for HSPA+, or HSPA Evolved.

HSPA+ is designed to enhance the mobile broadband user experience and enable a wide range of services. The technology delivers higher peak and average data rates, lower latency, better response times, longer battery life and an enhanced, always-on experience compared to the current generation of mobile networks.

The latest evolution of WCDMA technology, HSPA+ Release 7, will offer downlink data transfer rates of up to 28Mbps and uplink rates of up to 11Mbps. Future HSPA+ releases are expected to support downlink peak rates of 42Mbps to 84Mbps and uplink peak rates of 23Mbps by using a variety of advanced techniques, including multiple carriers for transferring data. HSPA+ is backward compatible with prior generations of WCDMA and does not require new spectrum for deployment. Operators can leverage their existing network and spectrum resources to offer next-generation wireless bandwidth and performance.

Qualcomm's MDM8200 chipset supports deployments in existing frequency bands, as well as in the 900MHz band and the 2.5GHz IMT-2000 extension band.

Click here for more information on Qualcomm


RELATED ARTICLES

Qualcomm, MYWAVE Electronics Sign WCDMA and TD-SCDMA Module/modem Card License Agreement

Grameen Foundation, Bakrie Telecom and Qualcomm Join Efforts to Enable Affordable Telecom Access to Rural Indonesia

Nokia and Qualcomm Enter Into a New Agreement

Competition for the Mobile Applications Ecosystem Grows

Mobile TV Growth Prospects - Alphabet Soup or Obvious Choice?

PMMV, MOPH, Qualcomm, CAT Telecom and Huawei Technologies Provide Advanced 3G and High-Speed Broadband Services in Northern Thailand

Who is Watching Mobile TV Now?

Qualcomm and Kirusa Enter into a Short Voice Service License Agreement

Asia-Pacific Suppliers to Lead Global Cellular Modem Industry Shipment by 2013

Qualcomm and Zhenhua Sign CDMA2000 Subscriber Unit License Agreement

Qualcomm and AsiaTelco Enter Into a 3G CDMA Subscriber Unit and Modem Card License Agreement


 
 
 
 
Related Articles
   

Texas Instruments Tops New Mobile Internet Device Platform Vendor Matrix Ranking

Phonak and NXP Develop New Ultra Low Power Wireless Communication Technology

STMicroelectronics' Power-line Transceivers to be Deployed in Automatic Meter Reading Project in China

Power Integrations' LinkSwitch-II Delivers Five-star Rating for Cellphone-charger Power Consumption

Wireless Network Traffic to Increase Tenfold

ITU advocates infrastructure sharing to counter investment drought

STMicroelectronics Updates 4Q08 Outlook

Xilinx Automotive Optical Flow Solution Targeted at Advanced Driver Assistance Systems

NXP Launches LDMOS Transistor for L-band Radar Applications

Fairchild Semiconductor Receives China Excellent Supplier Award from CEEA

   
 
Product News
   

NETGEAR's Powerline Adapters for HD, Multimedia Streaming now Available in Singapore

Power Integrations' LinkSwitch-II Delivers Five-star Rating for Cellphone-charger Power Consumption

Texas Instruments' Single-supply Auto-zero Sensor Amplifier Features Programmable Gain and Offset

NXP Launches LDMOS Transistor for L-band Radar Applications

Xilinx Automotive Optical Flow Solution Targeted at Advanced Driver Assistance Systems

   
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 

Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2008 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.