Peregrine Semiconductor Ships 300 Millionth UltraCMOS RFIC

(Business News & Technology News, 23 Jul 2008)

High-performance RF CMOS and mixed-signal communications ICs supplier Peregrine Semiconductor Corp. has shipped its 300 millionth UltraCMOS RFIC. The milestone was reached with an order for Peregrine's PE42672 SP7T RF switches that are designed into RF transmit and front-end modules for cellular handsets supporting the WCDMA, HSPA, EDGE and GSM/GPRS networks, currently the fastest growing segment of the wireless market.

The HaRP-enhanced PE42672 3G antenna switch utilized in the WCDMA design is a high-throw count RF switch that was introduced into the market in October 2005, and began shipping into major handset manufacturers throughout 2007 and 2008. The 3G mobile user demand for higher data rates is creating an unprecedented level of complexity in the RF front-end, and higher levels of integration are key to meeting customer requirements for exceptionally small form factors, cutting-edge features, and quick time-to-market. The superior linearity performance and reliability of Peregrine UltraCMOS RFICs delivered in a single-chip solution are playing a critical role in the design of RF modules.

"We continue to hear very favorable comments about Peregrine RF switches, and are seeing them in a number of mobile phones," comments Mark Christensen, RF Analyst for Prismark Partners. "The high levels of integration and extremely high performance afforded by the UltraCMOS process allows for new front-end architectures that can handle the complexities of multi-band, multi-mode wireless applications. Peregrine's success with global manufacturers in cost-sensitive markets should ultimately support the proliferation of this technology."

Historically, pin-diodes and GaAs-based devices held a dominant market position in the RF front end. However, as the demand for complex functionality in the front-end increased, designers sought a path toward integration of digital functionality. UltraCMOS technology offers the industry's only solution for high-performance RF combined with digital control, and the innovative flip-chip die for unprecedented space and cost savings.

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