DSP Subsystem Platforms Designed for Wireless, Multimedia Applications

( 1 Jul 2008 )

CEVA Inc. has launched its next generation DSP subsystem platforms targeted for developers using the CEVA-X family of DSP cores. The platforms come in two versions, the CEVA XS-1100A optimized for wireless baseband applications, and the CEVA XS-1200A aimed at multimedia and other applications requiring high-performance signal processing. The configurable, highly efficient hardware platforms reduce development effort, the risk of costly silicon re-spins and time-to-market for embedded processor applications. It uses industry standard system buses, offering designers the ability to add their own hardware blocks or connect the DSP to other systems present on chip, making integrating CEVA cores a very straightforward, efficient proposition.

Both platforms support critical low power design requirements through CEVA's smart Power Management Unit (PMU) technology, which includes automatic sleep/wake of each resource and matrix separately according to transaction type, source, destination, initiator and duration. Compared to previous generation platforms from CEVA, the new platforms offers designers 10 percent higher speed; 20 percent smaller die size, 20 percent lower leakage power and 10 percent lower dynamic power, 50 percent fewer clock-tree cells, and 5 percent decrease in MHz requirements for video codecs such as H.264.

The CEVA XS1100A platform is optimized for wireless baseband and general purpose DSP solutions and tightly couples the CPU and DSP, which is required for real time baseband processing.

The CEVA XS1200A platform, aimed at multimedia and other DSP-intensive applications, enables a decoupling of the CPU and DSP to support multiple independent clock systems. It integrates additional features that enhance the system processing power for applications such as digital multimedia devices.

CEVA Inc.