Click to navigate back to homepage  
Sunday, July 5, 2009 
  Search :



 
 
     
 
 
Business News & Technology News > Jun 2008
 
 

NXP Semiconductors Leads New NFC IC Vendor Matrix Ranking from ABI Research

(Business News & Technology News, 20 Jun 2008)


NXP Semiconductors has been ranked at the top of the latest Vendor Matrix released by ABI Research, which evaluates worldwide contactless IC vendors. Inside Contactless and Infineon Technologies claimed the second and third spots, respectively.

Developed by ABI Research, the Vendor Matrix is an analytical tool that provides a clear understanding of vendors' positions in specific markets. In this Vendor Matrix, the focus is specifically on ICs developed for and delivered to the contactless payment, ticketing and NFC markets.

For this particular matrix, under "innovation", ABI Research examined the companies' product and manufacturing innovations, their experience, leadership, and knowledge transfer, their relevance to the global market, and the breadth of their product offerings.

Under "implementation", ABI Research scrutinized the following criteria: the companies' share of the potential and addressed markets, their global sales and support capabilities, the breadth of the contactless markets they serve, and the reach of their multi-regional product delivery.

Click here for more information on the latest Contactless IC Vendor Matrix from ABI Research

 
 
 
 
Related Articles
   

Synopsys MVSIM Adopted for Low Power Verification of STw8500 Mobile SoC Platform

Femtocell Equipment Manufacturers Can Quickly Develop Residential and Enterprise Products with TI’s Femtocell DSP Family

High Power PD Controllers with Built-In Switchers Address IEEE 802.3at PoE+ Standard

Jitter Transceivers from National Semiconductor Deliver 30 Percent More Backplane and Cable Reach

IDT Completes Tundra Semiconductor Acquisition

STMicroelectronics Innovates Integrated Protection ICs Enabling Smaller, Sleeker Power-over-Ethernet Equipment

Linear Technology’s 16-Bit Octal SPI DAC Achieves ±4LSB INL

Vishay Siliconix 30V P-Channel TrenchFET Gen III Power MOSFET Sets New ‘Industry First’ With 2.6mΩ Maximum On-Resistance in SO-8 Footprint Area

IR’s IR3640M PWM Control IC Is Ideal For Energy-efficient DC-DC Applications

Altera Announces New Cyclone III LS FPGAs

   
 
Top News
   

Asia-Pacific Drives Global Mobile Revenue Growth

ZTE Helps CSL with Cutover to HSPA+ Network

SMIC Achieves Silicon Success with High Performance 45nm Process

SR and SiRF combine to launch a new era of connectivity and location

Huawei Opens its First LTE Lab in Asia Pacific

   
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 


 
 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2009 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.