Click to navigate back to homepage  
Wednesday, March 17, 2010 
  Search :



 
 
     
 
 
Business News & Technology News > Jun 2008
 
 

Rohde & Schwarz, Sequans Communications Collaborate on WiMAX Production Test Optimization

(Business News & Technology News, 2 Jun 2008)


Sequans Communications is collaborating with Rohde & Schwarz (R&S), one of the leaders in wireless communications test and measurement, to enable WiMAX large scale deployments, by taking manufacturing test of Sequans Wave 2 chipsets to the next stage.

"Rohde & Schwarz's expertise and long years of experience in radio production testing in combination with the company's worldwide proven support structure ensure that Mobile WiMAX products based on our chips meet the most stringent demands for quality," says Bernard Aboussouan, VP of Marketing and Business Development, Sequans.

Originally, RF alignment and verification procedures of mobile WiMAX end-user devices were developed for initial low-volume production, thus leaving a huge potential for speed optimization. The unique all-in-one concept of Rohde & Schwarz's R&S CMW270 WiMAX Communication Tester now enables volume manufacturers to exactly adapt their test strategy to the individual quality requirements of their product. The range may span from simplified RF alignment to complete signaling link verification.

Test time optimization is heavily considered within the R&S CMW270's platform architecture. Multi evaluation list mode and parallel TX/RX test algorithms significantly reduce chipset configuration and handling times. Internal switching between RF channels improves RF calibration of multi antenna devices (MIMO) even more by eliminating external adaptation.

Special WiMAX demodulation measurement algorithms are able to reduce measurement times by a factor of 10, compared to standard equipment. In combination with the general purpose RF (GPRF) functionality, the R&S CMW270 is also ready for transmit power and receive signal strength indication (RSSI) calibration of complementary technologies like WLAN or Bluetooth.

A live demonstration featuring Rohde & Schwarz's R&S CMW270 WiMAX Communication Tester in combination with Sequans Mobile WiMAX chip reference designs will be presented at the WiMAX Expo in Taipei this week, June 2 to 6.

"Sequans mobile WiMAX chips are in demand by many leading WiMAX equipment vendors. With the R&S CMW270, they now have the chance to benefit from the most flexible and optimized production test approach," says Gerhard Sonnde, Director of Subdivision T&M Central Marketing, Rohde & Schwarz.

Sequans SQN1130 chip for Mobile WiMAX mobile stations features industry leading high throughput and low power consumption. The Wave 2 MIMO chip delivers more than 30Mbps throughput while drawing less than 280mW of power in active mode and less than 10mW in idle mode.

Click here for more information on Rohde & Schwarz


RELATED ARTICLES ON SEQUANS

Mobile WiMAX Chip Integrates Baseband, RF, and Memory

Sequans Wins Best Chip Design Award from WiMAX World EMEA

WiMAX is Here

Agilent Technologies Announces Manufacturing Test Support for Sequans Wave 2 Chipset-based WiMAX Devices

ZyXEL and Sequans Partner to Deliver 4G Modems for Sprint's Xohm Network Launch


RELATED ARTICLES ON ROHDE & SCHWARZ

Rohde & Schwarz's Medium-power Transmitter Suitable for Outdoor Applications

Rohde & Schwarz Launches Asia HQ in Singapore

Rohde & Schwarz Launches Latest Compact EMC Test Solution

Rohde & Schwarz's Double-ridged Waveguide Horn Antenna Covers 800MHz to 18GHz

Portable Receiver for Radio Monitoring Capable to 7.5GHz

Rohde & Schwarz's Latest One-box Solution Features EMF Measurement Software for RF Emissions

Rohde & Schwarz's Signal Generators Now Feature DAB and T-DMB Options

Rohde & Schwarz's Latest RF Switching Matrix Handles All Types of Automated Test Procedures


Rohde & Schwarz's Latest Microwave Spectrum Analyzer Capable to 18GHz

Rohde & Schwarz Becomes Member of LTE Industry Initiative LSTI


 
 
 
 
Related Articles
   

Altium Adds Support for Xilinx Spartan-6 FPGA to Altium Designer

World's Largest PND Makers Integrate Siano's MDTV Receiver Chip Technology

Broadcom Crystal HD Technology Brings HD Multimedia Experience to Atom-based Netbook Platforms

Anritsu Intros First Bluetooth Low Energy Test Solution

LSI Samples 6Gbps SAS RAID-on-Chip IC for Next-gen PCI Express 3.0 Server Platforms

Intel Atom Integrates Graphics, Memory Controller for Netbooks

IR's IR11672A SmartRectifier IC Targeted at AC/DC Power Converters

Nokia, ST-Ericsson to Partner on TD-SCDMA

Atmel's Cortex-M3-based Flash MCUs Improve Impedance Matching, Lower Power Up to 50%

Microchip's 18-pin PIC MCUs Feature Enhanced Mid-range Core

   
 
Top News
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Anritsu Intros First Bluetooth Low Energy Test Solution

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Motorola Leads Fast-rebounding WiMAX Equipment and Device Market

   
 
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.