Click to navigate back to homepage  
Saturday, March 20, 2010 
  Search :



 
 
     
 
 
Business News & Technology News > May 2008
 
 

Intel Injects Additional Investment in WiMAX

(Business News & Technology News, 21 May 2008)


By Stephen Las Marias, Editor


Intel Corp., via its investment arm Intel Capital, boosted its investments in WiMAX through a RM50 million stake in Green Packet Bhd, the parent company of Packet One Networks (P1).

Intel and P1 will work to deploy Malaysia's first commercially available nationwide 802.16e WiMAX network by June 2008, said to be the first large-scale commercial deployment of mobile WiMAX in Southeast Asia, and the first large-scale deployment of an 802.16e 2.3GHz WiMAX network outside Korea.

The investment is said to allow Intel Capital up to a 6.34 percent stake in the main board-listed company.

Just recently, Intel, Google, Comcast, Time Warner, and Bright House Networks, have collectively invested $3.2 billion in Clearwire, the new wireless communications company formed by Clearwire and Sprint Nextel in the United States.

Click here for more information on Green Packet

Click here for more information on Packet One

Click here for more information on Intel Capital

Click here for more information on Intel


RELATED ARTICLES ON INTEL

Sprint Nextel, Cleawire Ressurect WiMAX Partnership, Create New Mobile Broadband Company

012 Smile.Communications Applies for Mobile WiMAX Trial Expansion to Tel Aviv-Ramat Gan Areas

Wireless IC Market Outpaced Wireline Chip Market in 2007

Wi-Fi Alliance Welcomes Atheros Communications as New Sponsor Member

WiMAX Forum Forecasts 133 Million WiMAX Users by 2012


RELATED ARTICLE ON PACKET ONE

Packet One Networks Enhances WiMAX Launch Readiness


 
 
 
 
Related Articles
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

MobGold Raises $12M Led by Fast Global Investments in Series B Financing

Anritsu Intros First Bluetooth Low Energy Test Solution

Nokia, ST-Ericsson to Partner on TD-SCDMA

CPCNet Wins Two International Awards in 2009

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Atmel's Cortex-M3-based Flash MCUs Improve Impedance Matching, Lower Power Up to 50%

Motorola Leads Fast-rebounding WiMAX Equipment and Device Market

First Commercial LTE Network Goes Live

WiMAX Forum Applauds Indian Government for WiMAX Spectrum Auction Announcement

   
 
Top News
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Anritsu Intros First Bluetooth Low Energy Test Solution

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Motorola Leads Fast-rebounding WiMAX Equipment and Device Market

   
 
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.