Click to navigate back to homepage  
Tuesday, March 16, 2010 
  Search :



 
 
     
 
 
Product News > May 2008
 
 

ARC Wireless Launches Generation II of Integrated Enclosure Solution for Wi-Fi and WiMAX

(Product News, 15 May 2008)


ARC Wireless Solutions Inc.'s Wireless Communications Solutions Division (ARC) announces the launch of the ARC IES, Generation II Integrated Enclosure Solution (GEN II), which features a number of updates from the original ARC IES, making it more user-friendly and versatile.

The GEN II Solution is compatible with all of ARC's Integrated Antennas from 900MHz to 5.8GHz, including dual polarization, embedded, bolt-on and external stand-alone and makes for simple inventory management. The quality of the GEN II follows the original ARC IES Integrated Enclosure Solution: it includes an IP-67 rating, heat dissipation and EMI control with the die-cast aluminum enclosure.

The GEN II has a patent pending universal radio mounting feature with tamper proof plugs and feed-throughs.

Click here for more information on ARC Wireless

Click here for more information on ARC Wireless's Wireless Communications Solutions Division


 
 
 
 
Related Articles
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Altium Adds Support for Xilinx Spartan-6 FPGA to Altium Designer

World's Largest PND Makers Integrate Siano's MDTV Receiver Chip Technology

Broadcom Crystal HD Technology Brings HD Multimedia Experience to Atom-based Netbook Platforms

STMicroelectronics Receives EuroDOCSIS 2.0 Certification for Set-top Box Reference Design

Intel Atom Integrates Graphics, Memory Controller for Netbooks

Nokia, ST-Ericsson to Partner on TD-SCDMA

Data Center Strategy Helps Migration from Physical to Virtual to Cloud

CPCNet Wins Two International Awards in 2009

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

   
 
Top News
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Anritsu Intros First Bluetooth Low Energy Test Solution

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Motorola Leads Fast-rebounding WiMAX Equipment and Device Market

   
 
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.