Click to navigate back to homepage  
Sunday, July 5, 2009 
  Search :



 
 
     
 
 
Issue > May 2008 > Product News
 
 

Fully Integrated NFC SoC for Contactless Communications

( 1 May 2008 )


STMicroelectronics has released a fully integrated secure System-on-Chip (SoC) solution implemented in advanced silicon technology for the fast emerging NFC (Near Field Communication) market. Implemented in 0.13-micron embedded non-volatile memory EEPROM technology, the ST21NFCA, a flexible fully integrated system-on-chip IC that offers a complete hardware capability for contactless communication at 13.56MHz, has all the necessary hardware and software for a complete NFC system, including support for all the NFC proximity and vicinity standards.

Based on the technology and the architectures already implemented in ST's advanced SIM card range, the ST21NFCA includes ST's advanced ST21 smart card microcontroller along with 36kB of EEPROM, 112kB of User ROM and 4kB of RAM. In addition, the chip includes an integrated RF analog front end (AFE) and embedded firmware that supports the existing contactless standards for proximity and vicinity. Additionally, the chip's fully integrated firmware provides fast and easy design and implementation for leading mobile phone and portable consumer equipment manufacturers.

STMicroelectronics
www.st.com


 
 
 
 
Related Articles
   

Synopsys MVSIM Adopted for Low Power Verification of STw8500 Mobile SoC Platform

Femtocell Equipment Manufacturers Can Quickly Develop Residential and Enterprise Products with TI’s Femtocell DSP Family

High Power PD Controllers with Built-In Switchers Address IEEE 802.3at PoE+ Standard

Jitter Transceivers from National Semiconductor Deliver 30 Percent More Backplane and Cable Reach

IDT Completes Tundra Semiconductor Acquisition

STMicroelectronics Innovates Integrated Protection ICs Enabling Smaller, Sleeker Power-over-Ethernet Equipment

Linear Technology’s 16-Bit Octal SPI DAC Achieves ±4LSB INL

Vishay Siliconix 30V P-Channel TrenchFET Gen III Power MOSFET Sets New ‘Industry First’ With 2.6mΩ Maximum On-Resistance in SO-8 Footprint Area

IR’s IR3640M PWM Control IC Is Ideal For Energy-efficient DC-DC Applications

Altera Announces New Cyclone III LS FPGAs

   
 
Product News
   

STMicroelectronics Innovates Integrated Protection ICs, Enabling Smaller, Sleeker PoE

Femtocell Equipment Manufacturers Can Quickly Develop Residential and Enterprise Products with TI’s Femtocell DSP Family

Alcatel-Lucent Launches “World's First” Green DSL

AT&T to Offer BlueAnt Q1 Bluetooth Headset

Aeroflex Expands its Flexible, Modular PXI Platform With High-Power Signal Generators for RF Component Test

   
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 


 
 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2009 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.