Baseband Development Platform Offers End-to-end 10Gb RapidIO Interconnect

( 1 May 2008 )

Tundra Semiconductor Corp. has launched what is said to be the market's first end-to-end RapidIO-enabled MicroTCA platform for wireless baseband, which offers end-to-end 10Gb RapidIO Interconnect for chip-to-chip and board-to-board links across the backplane. The platform will allow wireless telecom system vendors to expedite go-to-market schedule with this "baseband-in-a-box" solution.

The product features components from four leading vendors: the Mercury Ensemble MSW-100 RapidIO MicroTCA Switch Module, which includes Tundra's Tsi578; the CommAgility AMC-6487C Baseband Advanced Mezzanine Card, which includes Texas Instruments Inc.'s TCI6487 Multicore DSPs and Tundra's Tsi578 Serial RapidIO Switch; the Tundra Tsi574 Serial RapidIO Signal Analyzer; and the Fabric Embedded Tools RapidFET Probe.

Tundra Semiconductor Corp.
www.tundra.com