Click to navigate back to homepage  
Saturday, March 20, 2010 
  Search :



 
 
     
 
 
Product News > Apr 2008
 
 

Texas Instruments Launches New High-speed USB 2.0 On-The-Go Solution

(Product News, 7 Apr 2008)


Texas Instruments Inc. (TI) has released a high-speed Universal Serial Bus (USB) 2.0 On-The-Go (OTG) dual-role controller that provides flexible architecture to meet a multitude of customer-defined applications. It can operate either as a function controller for a USB peripheral or as the host/peripheral in point-to-point or multipoint communications. Featuring an idle mode operating current of only 0.1mA, the device will extend battery life in consumer devices, such as mobile handsets, portable media players or video applications.

The TUSB6020 is a compact solution for space-conscious equipment and comes in a 5x5mm package. It is compliant with the USB 2.0 OTG specification by the USB Implementer's Forum, ensuring interoperability with other USB devices. Its integrated USB 2.0 PHY provides design flexibility with one-port operation at a low speed of 1.5Mbps, full speed of 12Mbps and high speed of 480Mbps. The VLYNQ serial interface allows seamless interface to any VLYNQ-enabled application processor without loading the GPMC or EMIF ports.

Other key features include:
- Uses industry-standard Mentor Graphics USB 2.0 OTG core
- Supports session request protocol and host negotiation protocol
- On-chip integrated 45¦¸ high-speed termination, 1.5k¦¸ pullup, and 15k¦¸ pulldown resistors
- On-chip phase-locked loop to reduce noise on high-speed clocks
- Protection circuitry to withstand possible VBUS short

The TUSB6020 will add high-speed USB capability to any TMS320DM643x DaVinci technology-based product.

Click here for more information on the device

Click here for more information on Texas Instruments


RELATED ARTICLES

TI Launches Analog Front Ends for Ultrasound Systems

TI Releases DisplayPort Switches and HDMI/DVI Level Translators

Texas Instruments' Latest Linear Regulator Reduces Standby Power Consumption by 50%

Texas Instruments Launches Audio Processor for Hi-Fi Consumer Audio

Texas Instruments' Latest VoIP Chipset Solutions Support Microsoft's Unified Communications Platform

Texas Instruments Launches 2.4GHz RF Transceiver for ZigBee/IEEE 802.15.4 Applications

Texas Instruments Launches Closed-loop, Digital-input Class-D Amplifier

Ramp Discharge Fall Time Control

Mistral Releases Customized Software and Hardware Solutions for Texas Instruments' OMAP35x

Texas Instruments' Latest Audio Line Drivers Rated at 3.3V

Texas Instruments Launches Four-channel Wideband Digital Repeater Evaluation Module

Skyworks Increases Shipments of GPRS Front-end Modules for SoC Applications

Texas Instruments to Demonstrate Android Mobile Platform

Texas Instrument's OMAP 3 Chip Brings HD Camcorder and Full-page Web Browsing to Mobile Devices

NextWave Wireless Announces WiMAX Ecosystem Partners

Texas Instruments Launches Highly Integrated Transmit Processor for Wireless Basestations

Texas Instruments Challenges Industry to Unlock Innovation for Friendlier, Easier and Smarter Mobile User Experience

Texas Instruments' Newly Developed Process Techniques Tackle Low-power Issues in 45nm Wireless Devices

Texas Instruments Develops Single-chip DSP Coupling Math and Logic Functions for Beyond 3G Cellular Infrastructure Applications

Texas Instruments Launches Development Platform for HSPA+ Standard


 
 
 
 
Related Articles
   

Altium Adds Support for Xilinx Spartan-6 FPGA to Altium Designer

World's Largest PND Makers Integrate Siano's MDTV Receiver Chip Technology

Broadcom Crystal HD Technology Brings HD Multimedia Experience to Atom-based Netbook Platforms

LSI Samples 6Gbps SAS RAID-on-Chip IC for Next-gen PCI Express 3.0 Server Platforms

Intel Atom Integrates Graphics, Memory Controller for Netbooks

IR's IR11672A SmartRectifier IC Targeted at AC/DC Power Converters

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Atmel's Cortex-M3-based Flash MCUs Improve Impedance Matching, Lower Power Up to 50%

Microchip's 18-pin PIC MCUs Feature Enhanced Mid-range Core

   
 
Top News
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Anritsu Intros First Bluetooth Low Energy Test Solution

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Motorola Leads Fast-rebounding WiMAX Equipment and Device Market

   
 
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.