Click to navigate back to homepage
Friday, May 16, 2008 
  Search :



   
     
 
 
Business News & Technology News > Mar 2008
 
 

Spreadtrum Ships 30 Millionth CEVA-powered Baseband Chipset

(Business News & Technology News, 5 Mar 2008)


Spreadtrum Communications Inc., one of mainland China's leading wireless baseband chipset providers, has surpassed the 30 millionth shipment level for CEVA-powered wireless baseband chipsets. CEVA Inc. is one of the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile handsets, consumer electronics and storage applications. Spreadtrum currently deploys CEVA DSP technology in every baseband chipset it manufactures.

"This is a significant achievement for Spreadtrum," says Dr. Ping Wu, President and CEO of Spreadtrum. "Our strong strategic relationship with CEVA has ensured excellent support during the development of our wireless baseband chipsets and the shipment of our thirty millionth chip with their DSP is testament to the technology and support that CEVA has provided to us over the past four years."

"We are very pleased that Spreadtrum has achieved such significant successes with their CEVA-powered baseband chipsets in the burgeoning Chinese handset market," says Gideon Wertheizer, CEO of CEVA. "We look forward to continuing our successful relationship with them and developing new and innovative products for the wireless baseband market."

Click here for more information on Spreadtrum Communications

Click here for more information on CEVA


RELATED ARTICLES ON SPREADTRUM COMMUNICATIONS

Spreadtrum Communications Completes Acquisition of Quorum Systems

Spreadtrum, Amoi and Kuro Jointly Launch China's First Solution for Music Phones Offering Copyrighted Content

Spreadtrum's Baseband Chip Receives China Chip "Best Market Performance" Award


RELATED ARTICLES ON CEVA

CEVA to Exhibit Portfolio of Mobile Multimedia IP at IIC 2008

CEVA and ROHM Partner for Bluetooth 2.0+EDR Reference Design Platform


 
 
 
 
Related Articles
   

Questions Loom About Ultra-Wideband's Future as Bluetooth SIG Announces Use of 802.11

Texas Instruments' Ultra-thin Chip Module Enables Production of Graphics-rich Contactless Cards

K-micro, AnSem Partner to Develop Chipsets for the Home Networking Market

FMC, 4G Equipment to Drive Mobile Operator Spending in 2013

RF Transceiver Improves Receiver SNR by 10dB

Spotigo Develops Wi-Fi-based Positioning Technology

Avago Technologies Launches Ultra-Thin Autofocus LED for Camera Phones, DSCs

NEC to Set Up Mobile TV Network for Swisscom Broadcast in Time for the EURO 2008 Championships

Tantalum Chip Capacitors Feature 0.8Ω ESR

High-linearity Amplifiers Targeted at WiMAX and Next-Gen Cellular Networks

   
 
Top News
   

Questions Loom About Ultra-Wideband's Future as Bluetooth SIG Announces Use of 802.11

FMC, 4G Equipment to Drive Mobile Operator Spending in 2013

Spirent Communications and CTTL Team on A-GPS Testing for China

3G Spectrum Refarming Needed to Manage the Costs of Customer Expectations

GPS-enabled Handset Shipment to Reach 550 Million by 2012

   
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 

Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2008 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.