Click to navigate back to homepage  
Sunday, July 5, 2009 
  Search :



 
 
     
 
 
Business News & Technology News > Feb 2008
 
 

IMS Forum Unlocks Power of Interoperable High-Value Multimedia Services

(Business News & Technology News, 28 Feb 2008)


The IMS Forum's fourth IMS Plugfest was expanded to include billing and OSS/BSS support for IMS. The plugfest is being held this week, February 25 to 29, 2008, at the University of New Hampshire, InterOperability Lab (UNH IOL) in Durham.

On February 28, the IMS Forum and the UNH IOL will hold an open house and round-table conference to allow IMS service providers, analysts, equipment vendors and system integrators to witness IMS Plugfest IV live. The open house will also include a live demonstration of IMS benchmarking. The Round Table will be moderated by Ronald Gruia, Principal Analyst, Emerging Telecoms at Frost and Sullivan.

Committed to deliver to service providers robust, interoperable IMS services, participants in Plugfest IV are working on interoperability for voice, video and multimedia applications, fixed-mobile convergence (FMC), voice call continuity (VCC), femtocells, and on providing proper IMS test equipment, network robustness and protocol support for SIP and DIAMETER. Central to Plugfest IV is proving interoperability of IMS services for both the consumer and the enterprise unified-communication (UC) markets.

An important aspect of this testing is to define so-called "charging components," in other words, systems for rating and billing for service. "Seamless deployment of IMS applications with the charging components are critical to the commercial success of IMS architecture," says Ajay Gupta, Aricent Vice President of the Wireless, Convergence and Datacom business unit. "Our Plugfest IV participation with other members from the IMS industry would be a significant step in meeting the needs of equipment manufacturers and service providers for bringing in well-tested, seamlessly integrated, feature-rich IMS applications to market quickly."

"The level of IMS interoperability is growing rapidly, and, as a result, for Plugfest IV we are working with five test plans covering the IMS core network, core-class applications, messaging, fixed-mobile convergence, multimedia applications and charging," says Michael Khalilian, Chairman and President of IMS Forum, the industry's only association dedicated to interoperability and certification of IP Multimedia Subsystem (IMS) applications and services.

The forum also announces that HP and Amdocs are participating for the first time in an IMS Forum plugfest. Many participants in preceding plugfest events also are part of Plugfest IV, such as Acision, Alpha Networks, Aricent, Data Connection, Empirix, Intel, Mavenir Systems, Mu Security, NextPoint Networks, Radvision, Shenick Network Systems, Sonus Networks, Starent Networks, Tekelec and UNH IOL.

Results of Plugfest IV will be revealed on March 18 at Spring VON.X 2008 in San Jose, California, USA.

Click here for more information on the IMS Forum

 
 
 
 
Related Articles
   

Asia-Pacific Drives Global Mobile Revenue Growth

Alcatel-Lucent Launches “World's First” Green DSL

Inmarsat FleetBroadBand 150 Goes Live

NTT Com to Offer SLA for Global IPv6 Services

ZTE Helps CSL with Cutover to HSPA+ Network

NTT Com to Expand Arcstar Global IP-VPN in US, Launch New POP in Europe

Huawei to Deploy Europe’s ‘First’ SDR-enabled Commercial GSM/UMTS SingleRAN Network for TeliaSonera in Finland

SR and SiRF combine to launch a new era of connectivity and location

IDENT Technology AG Wins at GSMA Mobile Innovation Grand Prix EMEA Tournament

Truphone Adds 11 New Nokia Devices To Its Portfolio

   
 
Top News
   

Asia-Pacific Drives Global Mobile Revenue Growth

ZTE Helps CSL with Cutover to HSPA+ Network

SMIC Achieves Silicon Success with High Performance 45nm Process

SR and SiRF combine to launch a new era of connectivity and location

Huawei Opens its First LTE Lab in Asia Pacific

   
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 


 
 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2009 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.