NXP Semiconductors has released a new range of small-signal MOSFET devices housed in the one of the world's smallest packages, the SOT883, which boasts an ultra-small 1x0.6mm footprint. NXP's SOT883 MOSFETs deliver power dissipation and performance comparable to SOT23, while occupying only 14 percent of the printed circuit board space. Designed for use in a broad range of applications including DC/DC converter modules, power supplies for LCD TV and load switching for cellular phones and other portable devices, the SOT883 MOSFETs' ultra-small footprint, extremely low 0.5mm profile and switching speed and very low Rds(on) enable manufacturers to meet consumer demand for more compact and power-efficient products.
In addition to dramatically reducing the MOSFETs' footprint, NXP has eliminated the leads, which both frees up additional board space and improves thermal performance. Featuring Rds(on) values of less than 0.65¦¸ at 2.5V allows NXP's newest MOSFETs to offer higher current carry capacity than currently available 1x0.6mm MOSFETs. The new series also features improved switching speed, with turn on times between 12ns to 16ns and turn-off times between 17ns to 24ns.