Click to navigate back to homepage  
Sunday, March 21, 2010 
  Search :



 
 
     
 
 
Product News > Feb 2008
 
 

RFMD Launches System-on-Chip Solutions Designed to Enable Location-based Services in Mobile Devices

(Product News, 22 Feb 2008)


RF Micro Devices Inc. (RFMD) has released the RF8000 series of low-power location solutions for global positioning system (GPS) applications. The highly integrated software-based location solutions feature system-on-chip (SoC) architectures and are designed specifically for energy-sensitive mobile devices enabling location-based services.

Mobile device manufacturers using the RFMD's RF8000 series to enable location-based services will enjoy the benefits of a powerful processing engine implemented in a highly integrated, low power platform. The RF8000 architecture features an efficient RF design, flexible virtual correlation algorithms, powerful accelerator engine and innovative signal processing techniques, all delivered in a compact SoC format. The highly efficient architecture accommodates the stringent power requirements of cellular handsets, and the reduced solution size and minimal external component count are sensitive to the limited area available for complementary radios in mobile devices.

Click here for more information on RFMD


RELATED ARTICLES

RFMD Achieves DigRF3G Hardware Validation with Top-tier Handset Baseband Manufacturer

RFMD's Dual-Band GSM/GPRS Transmit Module for GSM900/DCS1800 Handsets

RFMD Announces Availability of 3G Transmit System

RFMD Supplies EDGE Power Amplifiers to Huawei for 3G Multimode Handsets

RFMD Intros MEMS Technology for Functional Integration in RF

RFMD to Launch New Enabling Technologies


 
 
 
 
Related Articles
   

Altium Adds Support for Xilinx Spartan-6 FPGA to Altium Designer

World's Largest PND Makers Integrate Siano's MDTV Receiver Chip Technology

Broadcom Crystal HD Technology Brings HD Multimedia Experience to Atom-based Netbook Platforms

LSI Samples 6Gbps SAS RAID-on-Chip IC for Next-gen PCI Express 3.0 Server Platforms

Intel Atom Integrates Graphics, Memory Controller for Netbooks

IR's IR11672A SmartRectifier IC Targeted at AC/DC Power Converters

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Atmel's Cortex-M3-based Flash MCUs Improve Impedance Matching, Lower Power Up to 50%

Microchip's 18-pin PIC MCUs Feature Enhanced Mid-range Core

   
 
Top News
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Anritsu Intros First Bluetooth Low Energy Test Solution

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Motorola Leads Fast-rebounding WiMAX Equipment and Device Market

   
 
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.