Qualcomm Announces Multiple HSPA+ Trials in 2008

(Top News, 18 Feb 2008)

Qualcomm Inc. recently announced that network operators including Hutchison 3G, Telecom Italia, Telefonica and Telstra have committed to trialing HSPA+ technology this year. Qualcomm's HSPA+ trials bring the technology—a seamless upgrade from HSPA delivering up to 28Mbps mobile broadband and increases in network capacity without the need for new spectrum—another step closer to commercialization.

The HSPA+ trials are expected to take place this year, enabling commercialization of the technology as early as 2009. The trials will use Qualcomm's Mobile Data Modem (MDM) MDM8200 chipset. Key features being trialed include 64-QAM HSDPA for 21Mbps downlink data rates and 2x2 downlink MIMO for 28Mbps downlink data rates.

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