Click to navigate back to homepage  
Friday, March 19, 2010 
  Search :



 
 
     
 
 
Business News & Technology News > Feb 2008
 
 

Rohde & Schwarz Becomes Member of LTE Industry Initiative LSTI

(Business News & Technology News, 15 Feb 2008)


Test and measurement instruments manufacturer Rohde & Schwarz (R&S) has joined the LTE/SAE Trial Initiative (LSTI), an industry initiative composed of leading telecommunications providers and network operators aiming to promote the further development of broadband mobile radio networks that are based on UMTS Long Term Evolution (LTE) technology. By becoming a member, R&S will contribute to the acceleration in interoperability testing (IOT) and the initial field tests. This, in turn, will shorten time-to-market for base stations and wireless devices of the next generation.

One objective of LSTI is to ensure the interoperability of wireless networks and wireless devices from different manufacturers. R&S will benefit the industry organization by providing its comprehensive expertise in test and measurement equipment for 2G, 3G, and LTE technologies. The company will thus support the manufacturers and operators with, for example, suitable IOT test scenarios for LTE network simulation. Moreover, R&S expert will share know-how gained through its active participation in the 3GPP standardization working groups.

"Our inclusion in the LTE/SAE Trial Initiative represents a clear signal for us. From the very start, Rohde & Schwarz has fully embraced the further development of LTE technology. The mutual exchange of knowledge with other members benefits the entire initiative, and thus plays a significant part in promoting the next generation of mobile radio," says Roland Steffen, Head of the Test and Measurement Division at Rohde & Schwarz.

Click here for more information on Rohde & Schwarz

 
 
 
 
Related Articles
   

Anritsu Intros First Bluetooth Low Energy Test Solution

Anritsu Intros Microwave USB Power Sensor with Coverage Up to 26GHz

Aeroflex Launches Complete Solution for RF Parametric Test of Wireless Subsystems, including LTE

Aeroflex Launches Complete Solution for RF Parametric Test of Wireless Subsystems, Including LTE

Tektronix Communications Announces Network Intelligence Products for Enhanced Performance Monitoring of Next Generation IP Networks

Flying Prober for Reverse Engineering

One-Button Test for 10GBASE-T Accelerates Validation Cycles

Conformance Testing of LTE User Equipment

Test Software Accelerates ZigBee Time-to-market

Tektronix Adds MIPI Support to DPO7000 Series Oscilloscopes

   
 
Product News
   

Altium Adds Support for Xilinx Spartan-6 FPGA to Altium Designer

IR's IR11672A SmartRectifier IC Targeted at AC/DC Power Converters

Simultaneous-sampling ADC Provides "True" 16-bit Performance for Polyphase Power-grid Designs

Microchip's 18-pin PIC MCUs Feature Enhanced Mid-range Core

Atmel's Cortex-M3-based Flash MCUs Improve Impedance Matching, Lower Power Up to 50%

   
 
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.