Click to navigate back to homepage
Thursday, November 20, 2008 
  Search :



 
 
     
 
 
Product News > Feb 2008
 
 

Drop-in Wireless Modules Allow Design Engineers to Easily Build Button-cell Powered Wireless Links

(Product News, 14 Feb 2008)


Using pre-approved modules developed by U.S.-based RF specialist RF Digital, designers without specialist RF knowledge can now build an Ultra-Low Power (ULP) ISM-band wireless link into a product or application within hours. Because all the RF development work has been done, the modules only require a digital I/O, power (+V) and ground (GND) connection.

Based on five Nordic Semiconductor Ultra-Low Power transceivers, the modules feature Nordic Semiconductor's reference designs and sample protocol code, require no specialist RF expertise to design-in, and can be replaced by standalone Nordic Semiconductor transceivers if and when required.

The modules are designed to work in almost any operating environment or product design with the exception of sealed metal enclosures, which the laws of physics dictate will act as an electromagnetic shield to RF.

Seven radio-only modules based on the following existing Nordic transceivers are being offered: the Nordic Semiconductor 2.4GHz nRF24L01 (RF Digital Modules RFD21010, RFD21676, RFD21677), nRF2401 (RFD21006), and nRF24E1 (RFD21018); plus the 433/868/915MHz nRF905 (RFD21002), and nRF9E5 (RFD21014). The modules based on the Nordic "E" transceivers (nRF24E1 and nRF9E5) also include on-board EEPROMs.

RF Digital has also developed six off-the-shelf application modules ready for instant drop-in. All application modules are FCC and IC-approved with no further approvals required. European CE approval will be granted shortly.

Click here for more information on RF Digital

Click here for more information on Nordic Semiconductor

 
 
 
 
Related Articles
   

Set-top Box Shipments to Peak in 2012

Total Available Market for Microwave Tubes Approaching $1B

Infocomm Singapore Overall Winner at APICTA Awards 2008

Smartphone Users Still Searching for the Ultimate Intuitive Interface

Axis Network Technology Launches LTE Remote Radio Head Platform

Scalable Network Technologies Introduces Breakthrough Emulation Technology for Mobile Wireless Networks

ZTE, Qualcomm and Aircell Collaborate on Industry-first In-flight Mobile Broadband System

Vertical Markets Offer Prospects for Fleet Management Systems Growth

Distributed IOs Communicate Wirelessly for the First Time

Shanghai Volkswagen Adopts MyClick Mobile Image Recognition Platform to Promote Lavida

   
 
Top News
   

ZTE, Qualcomm and Aircell Collaborate on Industry-first In-flight Mobile Broadband System

Economic Crisis Likely to Impact Mobile Phone Industry

Location Ecosystem Still Looking for Sustainable Growth and Viable Business Models

95 Million Cellular M2M Modules to Ship in 2013

Asia Home to More than Half of World Mobile Connections by 2011

   
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 

Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2008 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.