ZTE Demonstrates 5.76Mbps HSUPA

(Product News, 13 Feb 2008)

ZTE is demonstrating its new 5.76Mbps HSUPA (High Speed Uplink Packet Access) network equipment, which also recently passed interoperability testing, at the GSMA Mobile World Congress 2008 in Barcelona, Spain, being held this week.

This follows the launch of ZTE's 7.2Mbps HSDPA/2Mbps HSUPA network equipment at China's PT/Wireless & Networks Comm exhibition in October last year.

HSUPA is a UMTS uplink enhancement technology introduced in 3GPP R6. It has two phases: in phase I the maximum uplink data throughput is 1.9Mbps; in phase II the maximum data throughput is up to 5.76Mbps. HSUPA technology increases capacity and throughput, and improves spectrum efficiency as well, satisfying the growing demand for mobile services in wireless broadband networks.

"We are proud to have completed the 5.76Mbps HSUPA IOT with terminals using Qualcomm chips," said Fang Hui, ZTE's General Manager of WCDMA Products. "Our ability to launch the solution at the MWC show further validates our industry leading technology expertise in the HSPA field."

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