Click to navigate back to homepage  
Sunday, July 5, 2009 
  Search :



 
 
     
 
 
Product News > Feb 2008
 
 

Fujitsu Launches Smallest RF Module for Mobile WiMAX Devices

(Product News, 11 Feb 2008)


Fujitsu Ltd has launched what it claims to be the world's smallest radio frequency(RF) module for mobile devices, which supports all of the RF circuitry necessary for mobile WiMAX. Designed using 90nm CMOS process technology and co-developed with Fujitsu Laboratories Ltd, the MB86K71 RF module feature all of the RF circuits necessary for mobile WiMAX devices including RFIC, antenna switches, a power amplifier, filters, and an oscillator circuit, in a 15x15x1.5mm package.

The new RF module also supports MIMO technology, enabling high-speed and reliable wireless connections that are essential for Mobile WiMAX devices. Furthermore, this RF module can be connected to Fujitsu's previously released mobile WiMAX baseband chip, MB86K21, enabling customers faster development and faster time to market of mobile WiMAX devices.

Sample shipment is scheduled to start at the end of February 2008.

Click here for more information

 
 
 
 
Related Articles
   

Synopsys MVSIM Adopted for Low Power Verification of STw8500 Mobile SoC Platform

Femtocell Equipment Manufacturers Can Quickly Develop Residential and Enterprise Products with TI’s Femtocell DSP Family

High Power PD Controllers with Built-In Switchers Address IEEE 802.3at PoE+ Standard

Jitter Transceivers from National Semiconductor Deliver 30 Percent More Backplane and Cable Reach

IDT Completes Tundra Semiconductor Acquisition

STMicroelectronics Innovates Integrated Protection ICs Enabling Smaller, Sleeker Power-over-Ethernet Equipment

Linear Technology’s 16-Bit Octal SPI DAC Achieves ±4LSB INL

Vishay Siliconix 30V P-Channel TrenchFET Gen III Power MOSFET Sets New ‘Industry First’ With 2.6mΩ Maximum On-Resistance in SO-8 Footprint Area

IR’s IR3640M PWM Control IC Is Ideal For Energy-efficient DC-DC Applications

Altera Announces New Cyclone III LS FPGAs

   
 
Top News
   

Asia-Pacific Drives Global Mobile Revenue Growth

ZTE Helps CSL with Cutover to HSPA+ Network

SMIC Achieves Silicon Success with High Performance 45nm Process

SR and SiRF combine to launch a new era of connectivity and location

Huawei Opens its First LTE Lab in Asia Pacific

   
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 


 
 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2009 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.