Click to navigate back to homepage  
Monday, March 15, 2010 
  Search :



 
 
     
 
 
Product News > Feb 2008
 
 

Linear Technology Launches Receiver Subsystem Capable to 160MSps

(Product News, 5 Feb 2008)


Linear Technology has released LTM9001, the first in a series of System in a Package (SiP) signal chain receiver modules leveraging Linear's uModule packaging technology. The LTM9001 is a semi-customizable IF/baseband receiver subsystem that includes a high performance 16-bit Analog-to-Digital converter (ADC) sampling up to 160Msps, an anti-aliasing filter, and fixed gain differential ADC driver. This new family of integrated receiver subsystems, is intended to bridge the expertise gap between the RF world and digital domain to provide ease of use and shortened time to market.

Using pin-compatible product families, the LTM9001 can be configured for various sampling rates and the differential ADC driver can be substituted for fixed gain versions ranging from 8dB up to 26dB. The anti-aliasing filters can also be configured as Low-Pass or Bandpass filter versions, accepting input frequencies as high as 300MHz.

The LTM9001 is packaged in an 11.25x11.25mm LGA package, utilizing a multi-layer substrate that shields sensitive analog lines from the digital traces. Bypass capacitance is placed inside the module and close to the die, providing a space, cost and, more significantly, a performance advantage over traditional packaging.

Click here for more information on the device

 
 
 
 
Related Articles
   

Altium Adds Support for Xilinx Spartan-6 FPGA to Altium Designer

World's Largest PND Makers Integrate Siano's MDTV Receiver Chip Technology

Broadcom Crystal HD Technology Brings HD Multimedia Experience to Atom-based Netbook Platforms

LSI Samples 6Gbps SAS RAID-on-Chip IC for Next-gen PCI Express 3.0 Server Platforms

Intel Atom Integrates Graphics, Memory Controller for Netbooks

IR's IR11672A SmartRectifier IC Targeted at AC/DC Power Converters

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Atmel's Cortex-M3-based Flash MCUs Improve Impedance Matching, Lower Power Up to 50%

Microchip's 18-pin PIC MCUs Feature Enhanced Mid-range Core

   
 
Top News
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Anritsu Intros First Bluetooth Low Energy Test Solution

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Motorola Leads Fast-rebounding WiMAX Equipment and Device Market

   
 
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.