Click to navigate back to homepage  
Sunday, July 5, 2009 
  Search :



 
 
     
 
 
Product News > Feb 2008
 
 

Linear Technology Launches Receiver Subsystem Capable to 160MSps

(Product News, 5 Feb 2008)


Linear Technology has released LTM9001, the first in a series of System in a Package (SiP) signal chain receiver modules leveraging Linear's uModule packaging technology. The LTM9001 is a semi-customizable IF/baseband receiver subsystem that includes a high performance 16-bit Analog-to-Digital converter (ADC) sampling up to 160Msps, an anti-aliasing filter, and fixed gain differential ADC driver. This new family of integrated receiver subsystems, is intended to bridge the expertise gap between the RF world and digital domain to provide ease of use and shortened time to market.

Using pin-compatible product families, the LTM9001 can be configured for various sampling rates and the differential ADC driver can be substituted for fixed gain versions ranging from 8dB up to 26dB. The anti-aliasing filters can also be configured as Low-Pass or Bandpass filter versions, accepting input frequencies as high as 300MHz.

The LTM9001 is packaged in an 11.25x11.25mm LGA package, utilizing a multi-layer substrate that shields sensitive analog lines from the digital traces. Bypass capacitance is placed inside the module and close to the die, providing a space, cost and, more significantly, a performance advantage over traditional packaging.

Click here for more information on the device

 
 
 
 
Related Articles
   

Synopsys MVSIM Adopted for Low Power Verification of STw8500 Mobile SoC Platform

Femtocell Equipment Manufacturers Can Quickly Develop Residential and Enterprise Products with TI’s Femtocell DSP Family

High Power PD Controllers with Built-In Switchers Address IEEE 802.3at PoE+ Standard

Jitter Transceivers from National Semiconductor Deliver 30 Percent More Backplane and Cable Reach

IDT Completes Tundra Semiconductor Acquisition

STMicroelectronics Innovates Integrated Protection ICs Enabling Smaller, Sleeker Power-over-Ethernet Equipment

Linear Technology’s 16-Bit Octal SPI DAC Achieves ±4LSB INL

Vishay Siliconix 30V P-Channel TrenchFET Gen III Power MOSFET Sets New ‘Industry First’ With 2.6mΩ Maximum On-Resistance in SO-8 Footprint Area

IR’s IR3640M PWM Control IC Is Ideal For Energy-efficient DC-DC Applications

Altera Announces New Cyclone III LS FPGAs

   
 
Top News
   

Asia-Pacific Drives Global Mobile Revenue Growth

ZTE Helps CSL with Cutover to HSPA+ Network

SMIC Achieves Silicon Success with High Performance 45nm Process

SR and SiRF combine to launch a new era of connectivity and location

Huawei Opens its First LTE Lab in Asia Pacific

   
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 


 
 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2009 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.