Click to navigate back to homepage
Wednesday, October 8, 2008 
  Search :



   
     
 
 
Top News > Jan 2008
 
 

Haier Mobile and NXP Semiconductors Team Up to Deliver EDGE Experience to Chinese Users

(Top News, 15 Jan 2008)


Haier Mobile and NXP Semiconductors will form a strategic collaboration that commits Haier to adopt NXP's solutions for its EDGE mobile phones.

The strategic collaboration between the mobile terminal manufacturer and the upstream chip supplier will fully consolidate the technological and market advantages from both companies, further driving widespread deployment of EDGE technology in the domestic Chinese market. As a result, Haier's mobile users will be able to enjoy faster and more convenient mobile data services including streaming media and high-speed networking, as well as richer mobile entertainment experiences such as video and gaming. NXP's Nexperia cellular system solution 6120 / 5210 have already been adopted by Haier in several EDGE mobile phones, with the latest models to be available to the market in January 2008.

Based on the strategic collaboration with NXP, Haier will leverage NXP's solutions to develop and successfully launch more powerful EDGE mobile phones in 2008.

Click here for more information on NXP Semiconductors

 
 
 
 
Related Articles
   

ZTE Receives WiMAX Forum Wave2 Certification for System and Terminal Solutions

Home Networking CPE and Aggregation Devices to Generate $1.8B in 2013

Shipments of CE Devices with Wi-Fi to Reach 1 Billion by 2012

Cell Base Station Sales Down Steeply in 2008

GSMA Announces Mobile Broadband Service Mark Initiative Backed by Global Media Spend of $1B

NXP and Austria Card Enable Secure, Cashless Payments with Lufthansa Miles & More Credit Card

embWiSe Announces SDIOWorx Support on Freescale's Processor Platforms

2.4GHz Wireless Modules Deliver "Drop-in" Ultra Low Power for Just $8 in Volume

50 Million People Would Benefit from Wireless Home Healthcare Monitoring

AnalogicTech's Step-down Converter Delivers up to 2X Faster Transient Response

   
 
Top News
   

Home Networking CPE and Aggregation Devices to Generate $1.8B in 2013

Cell Base Station Sales Down Steeply in 2008

ZTE Releases World's First HSDPA TD-SCDMA Mobile Handset

VoIP Aside, Other IP Services to Generate $700B by 2013

Worldwide Mobile Cellular Subscribers to Reach 4 Billion Mark by End-2008

   
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 

Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2008 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.