Click to navigate back to homepage  
Friday, March 19, 2010 
  Search :



 
 
     
 
 
Business News & Technology News > Dec 2007
 
 

Broadcom Tops New Wi-Fi IC Vendor Matrix Ranking

(Business News & Technology News, 14 Dec 2007)


Broadcom Corp. has been ranked at the top of the latest Wi-Fi integrated circuit Vendor Matrix released by ABI Research. Atheros Communications and Marvell Semiconductor claimed the second and third spots in the company's most recent evaluation of worldwide Wi-Fi IC vendors.

"Broadcom may not provide the smallest or lowest power chipsets, but they are innovative across everything we looked at, and have executed well across the board," said principal analyst Philip Solis. "This is consistent with their market-leading position."

The Vendor Matrix is an analytical tool developed by ABI Research to provide a clear understanding of vendors' positions in specific markets.

Vendors are assessed by ABI Research on the important parameters of "innovation" and "implementation" across several criteria, unique to each vendor matrix.

For this particular matrix, under "innovation," ABI Research examined single chip 802.11g solutions, single chip 802.11n solutions, size, power consumption, and the ability to integrate with other technologies.

Under "implementation," ABI Research scrutinized the following criteria: overall market share, embedded market share, key customer wins, speed to market with Draft 11n products, and more integrated solutions.

Click here for more information on the Wi-Fi IC Vendor Matrix

 
 
 
 
Related Articles
   

Altium Adds Support for Xilinx Spartan-6 FPGA to Altium Designer

World's Largest PND Makers Integrate Siano's MDTV Receiver Chip Technology

Broadcom Crystal HD Technology Brings HD Multimedia Experience to Atom-based Netbook Platforms

LSI Samples 6Gbps SAS RAID-on-Chip IC for Next-gen PCI Express 3.0 Server Platforms

Intel Atom Integrates Graphics, Memory Controller for Netbooks

IR's IR11672A SmartRectifier IC Targeted at AC/DC Power Converters

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Atmel's Cortex-M3-based Flash MCUs Improve Impedance Matching, Lower Power Up to 50%

Microchip's 18-pin PIC MCUs Feature Enhanced Mid-range Core

   
 
Product News
   

Altium Adds Support for Xilinx Spartan-6 FPGA to Altium Designer

IR's IR11672A SmartRectifier IC Targeted at AC/DC Power Converters

Simultaneous-sampling ADC Provides "True" 16-bit Performance for Polyphase Power-grid Designs

Microchip's 18-pin PIC MCUs Feature Enhanced Mid-range Core

Atmel's Cortex-M3-based Flash MCUs Improve Impedance Matching, Lower Power Up to 50%

   
 
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.