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Product News > Dec 2007
 
 

RFMD Intros MEMS Technology for Functional Integration in RF

(Product News, 5 Dec 2007)


RF Micro Devices has introduced its microelectromechanical systems, or MEMS, technology for RF and other applications. The RFMD will construct a 200mm R&D wafer fab to support its continued MEMS development.

The RF MEMS transmit/receive switch and RF MEMS mode-switch can also be used in output circuit of power amplifiers (PAs) to create tunable PA. Both products are post-processed, above-IC, on RF CMOS SOI wafers and encapsulated in hermetically sealed, wafer-level packaged dielectric domes.

All necessary circuitry is integrated into underlying CMOS, including generation of voltages and control signals required for actuation of power MEMS switches.

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