CEVA and ROHM Partner for Bluetooth 2.0+EDR Reference Design Platform

(Business News & Technology News, 21 Nov 2007)

CEVA Inc. has announced a collaboration with ROHM Co. Ltd to offer a complete reference design platform for Bluetooth 2.0+EDR. Addressing the burgeoning Bluetooth market, the combined reference design integrates ROHM's 2.0+EDR Radio with CEVA's Bluetooth 2.0+EDR baseband and protocol stack IP for a high-performance, low-power Bluetooth 2.0+EDR platform.

"CEVA's Bluetooth 2.0+EDR baseband hardware and software protocol stack IP and ROHM's 2.0+EDR Radio are already being independently integrated by mutual customers," said Paddy McWilliams, Managing Director, Communications Product Line at CEVA. "To simplify the integration process and optimize the reference design for our collective customers, we are pleased to partner with ROHM and integrate our combined Bluetooth technologies into a reference Bluetooth 2.0+EDR platform."

"The silicon performance of our Bluetooth 2.0+EDR Radio along with the CEVA-Bluetooth IP at the recent UnPlugFest revealed a very competitive combined Bluetooth solution," said Hiroshi Ohyabu, Group Manager, Digital Network Project at ROHM. "We are delighted to further co-operate with CEVA in creating this platform and address the strong demand for a complete Bluetooth 2.0+EDR reference design from our customers."

CEVA-Bluetooth 2.0+EDR IP consists of an RTL baseband engine coupled with an ANSI C software stack. It is available as a discrete IP package for use with 3rd party embedded processors or it may be licensed together with a CEVA DSP for a complete Bluetooth platform. Such a platform can be also coupled with a complete set of audio codecs, voice codecs, echo cancellation and noise suppression algorithms, yielding an integrated Bluetooth and multimedia solution.

ROHM Bluetooth 2.0+EDR Radio consists of LNA, PA, TX/RX switch, Crystal Oscillator, regulator, VCO and Digital modulator/demodulator for FSK/PSK. It is a full CMOS IC RF transceiver, offering high performance and low power consumption for 2.4GHz band Bluetooth applications. The chip is integrated to minimize the use of external components and is available in VQFN40 package (6x6x1mm, pin pitch 0.5mm).

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