CEVA's DSP Cores are the Preferred Choice of the Leading Wireless Handset IC Suppliers and OEMs

(Business News & Technology News, 17 Oct 2007)

Fueled by an industry shift to open, licensable signal processing solutions for wireless applications, CEVA Inc. is emerging as a leader in licensing DSP cores to the world's leading wireless handset IC suppliers and OEMs. This emerging trend is evidenced by the announcement that NXP has licensed the CEVA-Teak DSP core for its ultra-low-cost cellular solutions.

NXP is the latest world-class semiconductor company to announce the adoption of CEVA DSP technology as the DSP architecture of choice for handset designs, joining a high-profile customer list, including Broadcom, Chipnuts, EoNex, Infineon, InterDigital, Renesas, ROHM, Sharp, Spreadtrum and VIA, as well as yet-to-be-announced major European and Taiwanese chipset suppliers. Quantifying CEVA's strong momentum in DSP, research firm Gartner reports CEVA's share of the worldwide market in 2006 at 53% based on design IP Revenue.

Baseband and multimedia solutions utilizing open DSP architectures, such as CEVA-TeakLite, CEVA-Teak and CEVA-X, are increasingly favored by handset manufacturers. At present, CEVA's DSP cores are shipping in wireless solutions deployed by many of the world's leading handset manufacturers, including Nokia, Samsung, Sony Ericsson, LG Electronics, Sharp, Lenovo, Panasonic, Palm, Arima, BenQ, ZTE, TCL, Amoi, Haier, Hisense, Ningbo Bird and CECT.

Will Strauss, President of Forward Concepts, commented: "The recent design wins for Broadcom and Infineon at Nokia with platforms incorporating CEVA DSPs, along with NXP's win at Samsung, are strong endorsements for CEVA's DSP technology by the handset industry's largest players. This, together with the success of other CEVA customers, including China's Spreadtrum Communications and a European 3G baseband chipset supplier, clearly support the strategy of adopting third-party, open DSP cores from CEVA for cellular baseband development. With its strong customer base, CEVA is well positioned to exploit the projected growth in the wireless handset industry."

Gideon Wertheizer, CEO of CEVA, stated: "Driven by the handset manufacturers, the wireless industry is undergoing a fundamental shift away from proprietary DSP architectures toward open DSP architectures like the CEVA DSP cores. This enables the handset manufacturers to reduce their chipset costs by sourcing their chips from multiple vendors using a common DSP architecture. By providing industry-leading DSP technology and a comprehensive roadmap to enable the baseband suppliers to develop solutions for ultra-low-cost handsets, multimode 2.5G/3G, as well as 4G baseband solutions, CEVA is ideally situated to build on its strong position within the handset industry."


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