Click to navigate back to homepage  
Sunday, July 5, 2009 
  Search :



 
 
     
 
 
Business News & Technology News > Sep 2007
 
 

NextWave Broadband and Huawei Technologies Cooperate to Conduct Interoperability Testing and Field Trials of Mobile WiMAX

(Business News & Technology News, 28 Sep 2007)


NextWave Broadband Inc., a subsidiary of NextWave Wireless Inc. and a manufacturer of advanced mobile WiMAX chipsets, and Huawei Technologies Co. Ltd, a provider of next-generation telecommunications network solutions, are conducting interoperability testing of NextWave's mobile WiMAX chipsets, based on the IEEE 802.16e standard, with Huawei's WiMAX infrastructure equipment.

The testing, being conducted at NextWave Broadband's facilities in San Diego, California, is evaluating the interoperability of NextWave's first-generation mobile WiMAX chipset which includes the NW1100 baseband system-on-a-chip (SOC) and matched NW1200 multi-band RFIC and Huawei's WASN9770 ASN-GW and BTS3703 three sector BTS platforms.

In addition to the interoperability evaluation, Huawei's commercial WiMAX equipment is also being tested at NextWave's trial network facility located in Henderson, Nevada. Key features being tested include handover, mobility, and enhanced services such as Voice-over-IP (VoIP) and video streaming.

Click here for more information on Huawei

Click here for more information on NextWave Broadband

 
 
 
 
Related Articles
   

AT&T to Offer BlueAnt Q1 Bluetooth Headset

Alcatel-Lucent Launches “World's First” Green DSL

Synopsys MVSIM Adopted for Low Power Verification of STw8500 Mobile SoC Platform

Cellular South Sponsors Netbook Design Challenge Contest

High Power PD Controllers with Built-In Switchers Address IEEE 802.3at PoE+ Standard

Meru Networks Ranks Second In Worldwide Market Share For 802.11n Enterprise Wireless LANs, Dell'Oro Report Says

GSMA Advances Embedded Mobile Initiative With Launch of Competition

Stantum and Sitronix Team to Meet Demand for Cost-Effective, High-Performance Multi-Touch in Consumer and Mobile Applications

SR and SiRF combine to launch a new era of connectivity and location

USB To Get Boost from SuperSpeed

   
 
Top News
   

Asia-Pacific Drives Global Mobile Revenue Growth

ZTE Helps CSL with Cutover to HSPA+ Network

SMIC Achieves Silicon Success with High Performance 45nm Process

SR and SiRF combine to launch a new era of connectivity and location

Huawei Opens its First LTE Lab in Asia Pacific

   
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 


 
 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2009 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.