Single-package WLAN Solution Optimized for Handheld Applications

( 1 Sep 2007 )

NXP Semiconductors' BGM220, claimed to be the world's smallest, single-package 81-pin TFBGA Wireless LAN (WLAN) solution, feature ultra low power consumption optimized for handheld applications such as feature phones and smartphones, handheld game consoles and PDAs. Building on its predecessor BGW211, the BGM220 uses the 802.11b/g WLAN standard to enhance the user connectivity experience, with a form factor allowing manufacturers to develop even smaller handheld devices. The device also provides extended wireless access by enabling simultaneous Bluetooth and WLAN connectivity. The BGM220 includes the RF and Baseband/MAC functions in a single 5x5mm package that supports the SDIO/SPI host interfaces, and is designed to meet key WFA interoperability requirements including WPA2 and WMM and supports all relevant enterprise security requirements with CCX extensions.

NXP Semiconductors
www.nxp.com