Click to navigate back to homepage  
Sunday, March 21, 2010 
  Search :



 
 
     
 
 
Business News & Technology News > Jun 2007
 
 

JMD Showcases Global Universal Radio Unit Technology

(Business News & Technology News, 5 Jun 2007)


Jacket Micro Devices Inc., a supplier of integrated RF modules for high performance wireless products, published a paper on a complete dual band WLAN module with two transmits and two receives in a package measuring 4x8mm, approximately four times smaller than the industry standard, at Microwave Week 2007 in Honolulu, Hawaii.

JMD used the module to illustrate how the company's patented Multilayer Organic (MLO) technology can be used to design, fabricate and implement a complete multi-band radio unit using SOP technology for dual band WLAN, WiMAX and Bluetooth technology in a single module. JMD's CTO and Co-Founder, Dr. George White, presented the technology through a white paper entitled "Global Universal Radio Units (GURU) Realized Using Multilayer Organics (MLO)" during a session related to new SiP technologies on Sunday, June 3.

"JMD's technology opens new doors for manufacturers of mobile devices such as PDAs and laptop computers," said Jim Stratigos, CEO, JMD. "Our customers will use this technology to integrate more functionality into a single mobile communication device that fits in the palm of your hand."

The paper describes the use of JMD's Multilayer Organic technology in developing smaller, high performance multi-band radio components for mobile devices such as laptops and hand-held devices. The paper contends that as many as five wireless standards can be incorporated into a package measuring no larger than 70mm², enabling a single small device to incorporate functions such as GSM, WLAN, WiMAX, Bluetooth and GPS without adding significant weight or size.

Click here for more information

 
 
 
 
Related Articles
   

Altium Adds Support for Xilinx Spartan-6 FPGA to Altium Designer

World's Largest PND Makers Integrate Siano's MDTV Receiver Chip Technology

Broadcom Crystal HD Technology Brings HD Multimedia Experience to Atom-based Netbook Platforms

LSI Samples 6Gbps SAS RAID-on-Chip IC for Next-gen PCI Express 3.0 Server Platforms

Intel Atom Integrates Graphics, Memory Controller for Netbooks

IR's IR11672A SmartRectifier IC Targeted at AC/DC Power Converters

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Atmel's Cortex-M3-based Flash MCUs Improve Impedance Matching, Lower Power Up to 50%

Microchip's 18-pin PIC MCUs Feature Enhanced Mid-range Core

   
 
Product News
   

Altium Adds Support for Xilinx Spartan-6 FPGA to Altium Designer

IR's IR11672A SmartRectifier IC Targeted at AC/DC Power Converters

Simultaneous-sampling ADC Provides "True" 16-bit Performance for Polyphase Power-grid Designs

Microchip's 18-pin PIC MCUs Feature Enhanced Mid-range Core

Atmel's Cortex-M3-based Flash MCUs Improve Impedance Matching, Lower Power Up to 50%

   
 
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.