Click to navigate back to homepage  
Sunday, March 21, 2010 
  Search :



 
 
     
 
 
Product News > Apr 2007
 
 

JMD Delivers First Integrated Front-End Module for WiMAX Devices

(Product News, 19 Apr 2007)


Jacket Micro Devices Inc. (JMD) today announced the launch of the M30001, a highly integrated and performance optimized WiMAX front end module containing all active and passive components required to interface WiMAX transceivers more directly to the antenna.

The M30001 product line is designed to address device OEM requirements for 4G multi-mode, multi-band applications where size, performance and cost are critical. JMD's M30001 reduces critical board space and power requirements, supports virtually any transceiver or baseband architecture, and simplifies RF design through higher levels of component integration.

"Our customers are excited to learn about our expanding family of front-end modules for multiple WiMAX bands and regions," said Chris Conlin, vice president, marketing and sales, JMD. "As the industry moves towards smaller form factors, more complex feature sets and more stringent power requirements, JMD is positioned to offer customers a highly differentiated, fully qualified product portfolio supporting all major WiMAX frequency bands. Our goal is to make mobile broadband more easily delivered in every market."

The product is the newest of JMD's 802.16e family of front-end modules designed to support WiMAX applications in Asian, European and North American markets. JMD's products support the IEEE 802.16e-2005 interface definition, with built-in power detection and coupling. The M30001 is a fully matched 40-pin, full-duplex front-end module in a small and efficient 7.5x7x1.4mm LGA package. JMD's WiMAX front-end modules will be available for sampling in Q2 2007.

Click here for more information

 
 
 
 
Related Articles
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Altium Adds Support for Xilinx Spartan-6 FPGA to Altium Designer

Broadcom Crystal HD Technology Brings HD Multimedia Experience to Atom-based Netbook Platforms

STMicroelectronics Receives EuroDOCSIS 2.0 Certification for Set-top Box Reference Design

Intel Atom Integrates Graphics, Memory Controller for Netbooks

Nokia, ST-Ericsson to Partner on TD-SCDMA

Data Center Strategy Helps Migration from Physical to Virtual to Cloud

CPCNet Wins Two International Awards in 2009

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Atmel's Cortex-M3-based Flash MCUs Improve Impedance Matching, Lower Power Up to 50%

   
 
Product News
   

Altium Adds Support for Xilinx Spartan-6 FPGA to Altium Designer

IR's IR11672A SmartRectifier IC Targeted at AC/DC Power Converters

Simultaneous-sampling ADC Provides "True" 16-bit Performance for Polyphase Power-grid Designs

Microchip's 18-pin PIC MCUs Feature Enhanced Mid-range Core

Atmel's Cortex-M3-based Flash MCUs Improve Impedance Matching, Lower Power Up to 50%

   
 
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.