QUALCOMM and its partners demonstrate latest advances in mobile broadband technologies

(Business News & Technology News, 30 Mar 2007)

QUALCOMM Inc. is showcasing a wide range of innovative wireless solutions at CTIA WIRELESS 2007 in Orlando, Florida, March 27-29, Hall A3 of the Orange County Convention Center.

Working with its partners, QUALCOMM is driving the global adoption of mobile broadband. According to Wireless Intelligence, there are more than 430 million 3G wireless subscribers worldwide. From mobile TV to single-chip solutions for sleeker, stylish cell phones, QUALCOMM will highlight its successful collaborations that are enabling the rapid growth of mobile broadband and enriching the lives of end users.

"Mobile broadband is here today, and QUALCOMM is accelerating 3G adoption by working with our industry partners to bring innovative wireless products and solutions to market," said William F. Davidson Jr., Vice President, global marketing and investor relations for QUALCOMM. "Our goal is to ensure that mobile phones and wireless services meet the needs of consumers in both the developed and developing markets. At CTIA this year, QUALCOMM will demonstrate some of the innovative solutions driving 3G services and will offer a view of what is to come in wireless technology."

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