TI announces a next generation programmable DSP capable of handling multiple 3G air interface standards and a range of basestation form factors on a single chip. The 1GHz TMS320TCI6482 DSP consumes 3 W of power and provides infrastructure OEMs with a platform to upgrade current systems and expand product portfolios. The TCI6482 reduces the power consumed per channel, delivering more processing headroom for increased user density. The device also simplifies system-level thermal management. Built on the company’s 90 nm process, this DSP offers several enhancements on the previous TMS320C64x-based products. The TCI6482 features 28 new DSP instructions that offer specific capabilities that enable more applications such as HighSpeed Download Packet Access (HSDPA). In addition, the product offers a serial Rapid IO interconnect for scalable connectivity, higher system bandwidth, and reduced latency and overhead for packet data processing. Texas Instruments