RoseStreet Labs Opens 3D/MEMs Packaging R&D Laboratory

(Business News & Technology News, 12 Aug 2005)

RoseStreet Labs recently opened a 3D R&D laboratory for next-generation semiconductor packaging. The company and its subsidiary, FlipChip International, develop new materials and processes for packaging utilized in leading wireless products.

Bob Forcier, president and CEO of RoseStreet Labs, said, "This opening of our new R&D lab and our alliance with our close partner, SUSS MicroTec, is part of our five-year technology roadmap to provide next-generation solutions to our valued customers in the areas of wafer-level MEMs, sensor, System-in-Package (SiP) and advanced 3D packaging."

Headquartered in Phoenix, AZ, RoseSteet Labs has capabilities in polymer development, metal deposition, lithography, 3D packaging, SiP, MEMs packaging and interconnect development. RoseStreet Labs R&D offers contract R&D services in addition to its internal R&D work in support of FlipChip International's globally recognized flip-chip and wafer level packaging product lines.