Click to navigate back to homepage  
Sunday, March 21, 2010 
  Search :



 
 
     
 
 
Business News & Technology News > Nov 2009
 
 

SiGe’s 2.4GHz PA and GPS Receiver IC Voted Leading Products at EDN China Innovation Awards 2009

(Business News & Technology News, 20 Nov 2009)


SiGe Semiconductor Inc., a global supplier of radio frequency (RF) front-end solutions for wireless systems, has been awarded Leading Product status in the high-profile and highly competitive Electronic Design News China (EDNC) Innovation Awards for 2009. SiGe’s SE2597L power amplifier (PA) and SE4150L GPS receiver IC were selected in the Communication IC and Analog/Mixed Signal IC categories respectively.

Commenting on winning the award, Bill Haberlin, Chief Operating Officer and Vice President Sales at SiGe Semiconductor, said, “We are delighted to receive industry recognition from this prestigious EDNC award for the SE2597L and the SE4150L. This is the third year in succession that products developed by the SiGe team have been honoured by EDNC.” Haberlin added, “SiGe’s 2597L has become the standard for 802.11bgn functionality across a broad array of personal computing, WLAN network access point and gaming products. The 4150’s unique signal processing architecture allows manufacturers to design with a complete single-chip solution for personal navigation devices using either internal or external antennas. It is satisfying to find that EDNC’s knowledgeable design engineer readers and respected judging panel have been quick to recognize how SiGe’s 2.4 GHz power amplifier and GPS receiver IC allow engineers to capitalize on the rapidly growing demand for both wireless networking and navigation in consumer electronics products.”

The award-winning SE4150L is SiGe’s fourth generation of market-leading GPS receivers..It is the world’s smallest GPS receiver IC and features an integrated low-noise amplifier along with the ability to take advantage of antennas both internal and external to next-generation personal navigation devices. SiGe Semiconductor specifically designed the SE4150L to address the three primary challenges associated with embedded GPS applications: small size, low power, and low price - all while raising the bar for performance and functionality.

The SE2597L is a PA designed specifically for 2.4GHz ISM band applications, including 802.11bgn networking. This highly integrated BiCMOS device is part of SiGe Semiconductor's successful line of discrete 2.4 GHz silicon PAs. This PA aims to improve power consumption for WLANs and ISM band applications. It also reduces bill of materials (BoM), as well as cutting power while delivering +20dBm for 2.4GHz wireless applications.

The EDNC Innovation Awards recognize innovation that has led to technology or product advancements. A panel of industrial experts and EDNC's technical editors selected the finalists in this year's competition. Readers then selected the winners through an online ballot hosted on EDNC's website. SiGe Semiconductor and other award-winning companies were presented with their awards at a ceremony held in Shenzhen, China on the 18th of November. “Everyone at SiGe appreciates the fact that China’s engineering community has recognized the SE2597L and the SE4150L and we are very honored to receive this prestigious industry award,” Haberlin concluded.

 
 
 
 
Related Articles
   

World's Largest PND Makers Integrate Siano's MDTV Receiver Chip Technology

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Atmel's Cortex-M3-based Flash MCUs Improve Impedance Matching, Lower Power Up to 50%

Digi, Qualcomm to Promote Wireless M2M Designs Incorporating Gobi Technology

PTC Launches High Sensitivity OOK /ASK Superheterodyne Receiver

ANADIGICS Announces ‘Industry's First’ Family of Gateway Splitters Featuring Up to Eight RF Outputs

austriamicrosystems Announces a High Performance Single-channel 125kHz LF Wakeup Receiver Requiring Minimal External Components

Andrew Packs More Backhaul Power in Smaller Microwave Antenna

Ruckus Wireless Helps Operators Reach Profitability Faster With First End-to-End Smart Wi-Fi Broadband Access System

Molex Expands RF Capabilities with Zhenjiang Tean Telecom & Appliance Acquisition

   
 
Top News
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Anritsu Intros First Bluetooth Low Energy Test Solution

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Motorola Leads Fast-rebounding WiMAX Equipment and Device Market

   
 
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.