Laird Technologies Expands EMI Sentry Product Portfolio

(Product News, 3 Nov 2009)

Laird Technologies Inc. has announced the addition of three products to its EMI Sentry Form-In-Place gasket family.

This top-of-the-line Form-In-Place gasket family provides EMI shielding while offering heat and humidity resistance, excellent adhesion strength, and a minimal compression set. These qualities improve reliability by increasing the durability and longevity of assemblies. In addition, fast handling and rapid curing speed up productivity, while increased softness offers the cost saving advantage of volume dispensing.

The three new gasket products are composed of specially-designed pastes which can be dispensed onto a metal or plastic substrate:
• SNC70-HXP -- consists of nickel/graphite-filled silicone that cures at HTV (High Temperature Vulcanization)
• SNC70-RXP -- consists of nickel/graphite-filled silicone that cures at RTV (Room Temperature Vulcanization)
• SNN60-RXP -- consists of silver/nickel-filled silicone that cures at RTV (Room Temperature Vulcanization)

“The latest EMI Sentry FIP additions of the SNC70-RXP, SNC70-HXP, and SNN60-RXP offer the industry a cost-effective and high-performing solution,” said Scott Stephan, Laird Technologies EMI Product Director.

“They are high performing products suitable for today’s market, meeting high temperature requirements while providing excellent EMI shielding in demanding applications.”
The EMI Sentry gasket family is ideal for the handset, base station, military, and consumer electronics markets.