Click to navigate back to homepage  
Monday, March 15, 2010 
  Search :



 
 
     
 
 
Product News > Oct 2009
 
 

Dual SIM Holder Platinum, Miniature Concentrate of Technology

(Product News, 28 Oct 2009)


The Swiss Company Stancom announces the launch of its latest innovation on Dual SIM Holder *, the "Platinum", a true innovative miniature concentrate of technology.
The new Platinum V7.0 differs from previous versions Black Silver Gold V6 presenting itself as a completely new hardware design and an innovative new software.
Hardware:
This Dual Sim Card was designed and developed with all the latest generation of semi-conductor, flexible printed circuit board technologies (CoF), and a high-capacity microcontroller Ultra thin chip melted into the mass.
The important thinness of the devise allows it to be inserted into all latest mobile phone generation such as Iphone, HTC, Nokia....that have a very thin SIM slot.
Rigid and flexible at the same time with its new hardware design, this Platinum model ensures a high reliability and is compatible with the latest mobile phones and SIM & USIM cards from all mobile operators.
Software:
Software side, Platinum has been developed to support 3G and HSDPA networks and guaranteed for the first time in Dual SIM Holder technology connections to 3G networks - UMTS - WCDMA - HSDPA (High Data transfer speed).
Thus, Platinum users can access the Internet and video telephony.
Integrating the functions of secret agenda, confidential directory, Platinum also embeds the encrypted SMS function to communicate via SMS in confidence.
The combination of quality materials and software, manufacturing quality and inspection requirement allows for the first time in Dual Sim area to go up a gear and to get 2 SIM cards in one mobile phone with all internet options enabled in the latest generation of mobile phones (Apple Iphone, Nokia E71, HTC Touch, .....)

 
 
 
 
Related Articles
   

Mobile Phone Displays Benefit from Emerging Markets

GSMA Launches Green Manifesto for the Mobile Industry

Fairchild Semiconductor’s MicroFET Thin Package Targets Battery- Charging and Power-Multiplexing Applications

Laird Technologies Expands EMI Sentry Product Portfolio

Terepac And IMEC Join Forces In Low-Cost Flexible Electronics Packaging

Stantum and Sitronix Team to Meet Demand for Cost-Effective, High-Performance Multi-Touch in Consumer and Mobile Applications

CoActive KDM's Sub-200µm-Thick Light Guide Foils Uniformly Illuminate Keypads on Mobile Phones, Handheld Electronic Devices

Stantum Granted Key Patents on Its Multi-Touch Technology

IMS 2009 to Highlight Latest RF/Microwave Technologies, Applications and Trends

Rogers Introduces Low-Z Axis Material for Airborne Antenna Applications

   
 
Top News
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Anritsu Intros First Bluetooth Low Energy Test Solution

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Motorola Leads Fast-rebounding WiMAX Equipment and Device Market

   
 
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.