Click to navigate back to homepage  
Saturday, March 20, 2010 
  Search :



 
 
     
 
 
Product News > Jul 2009
 
 

Doodle Labs Releases ‘Highest’ Performance Industrial Wireless IP Modules

(Product News, 21 Jul 2009)


Doodle Labs, in ruggedized wireless networking products, has announced the availability of the carrier-class, industrial wireless IP modules. These modules are the first ever radios that provide serial RS232/422/485 as well as RJ45 Ethernet interfaces for the industrial applications and provide high Tx power in the frequency ranges of 4.8 – 6.0 GHz (DLM103) and 2.3GHz to 2.5GHz (DLM101), programmable 5/10/20/40 MHz channel width for the operation in the unlicensed ISM and UNI as well as licensed WiMax and Home Land Security bands.

The superior design of the RF interface allows the modules to achieve the long range of up to 80 Km. The wireless modules include advanced features such as Adaptive Noise Immunity, Bandwidth Control, QoS, Routing and 128-bit AES data security standard. In addition, the embedded open source Linux OS allows application layer customization for easy integration into various wireless SCADA/DCS solutions based on industry standards like Modbus. Now the technology is ready for integration into industry standards like ISA100 and IEC 61850.

The design of the DLM101 and DLM103 wireless modules feature RP-SMA antenna connector for flexibility in system design. The low loss, rugged RP-SMA connector allows for improved mechanical stability and the use of higher quality, low loss antenna cables. The modules have built-in surge protection circuits for the RF and other interfaces to significantly improve reliability in harsh ESD and EMP sensitive environments. The operating temperature range is from -10º C to +60º C.

"During the development of these radios we have been working with our OEM customers to integrate them in various industrial applications." said Raghu PV, General Manager of Doodle Labs. "The feature set bundled in these radios is the result of an accumulation of suggestions and feedback we have obtained during the collaborative design efforts and field performance experiences."

The DLM101 and DLM103 modules are already in mass production and available for large quantity shipments. The modules will carry modular FCC, IC, and CE approvals (in progress).

 
 
 
 
Related Articles
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Altium Adds Support for Xilinx Spartan-6 FPGA to Altium Designer

Broadcom Crystal HD Technology Brings HD Multimedia Experience to Atom-based Netbook Platforms

STMicroelectronics Receives EuroDOCSIS 2.0 Certification for Set-top Box Reference Design

Intel Atom Integrates Graphics, Memory Controller for Netbooks

Nokia, ST-Ericsson to Partner on TD-SCDMA

Data Center Strategy Helps Migration from Physical to Virtual to Cloud

CPCNet Wins Two International Awards in 2009

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Freescale Sees Growth in Smart Mobile Devices

   
 
Top News
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Anritsu Intros First Bluetooth Low Energy Test Solution

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Motorola Leads Fast-rebounding WiMAX Equipment and Device Market

   
 
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.