Click to navigate back to homepage  
Wednesday, March 10, 2010 
  Search :



 
 
     
 
 
Product News > Jun 2009
 
 

Raytheon Demonstrates Breakthrough Antenna Technology During Air Force Flight

(Product News, 30 Jun 2009)


During a recent flight test, Raytheon Co. successfully demonstrated breakthrough antenna technology that dramatically improves and delivers on the next generation of airborne communications for wide-body aircraft.

The Advanced Multiband Communication Antenna System (AMCAS), developed for the US Air Force, is an extremely low-profile antenna that significantly reduces drag on an aircraft. Attaching to the aircraft skin, the antenna extends 8 1/2 inches. This solution, which simplifies installation and minimizes time out of service, is an affordable alternative to today's antennas, which require more extensive and complex installations and extend considerably farther from the aircraft's fuselage.

During the test, the AMCAS antenna, which is being evaluated for use with the Family of Advanced line-of-sight Terminals, communicated with the Milstar satellite's medium data rate waveform. FAB-T is the Air Force's next-generation communications system.

 
 
 
 
Related Articles
   

World's Largest PND Makers Integrate Siano's MDTV Receiver Chip Technology

Digi, Qualcomm to Promote Wireless M2M Designs Incorporating Gobi Technology

PTC Launches High Sensitivity OOK /ASK Superheterodyne Receiver

ANADIGICS Announces ‘Industry's First’ Family of Gateway Splitters Featuring Up to Eight RF Outputs

austriamicrosystems Announces a High Performance Single-channel 125kHz LF Wakeup Receiver Requiring Minimal External Components

Andrew Packs More Backhaul Power in Smaller Microwave Antenna

Ruckus Wireless Helps Operators Reach Profitability Faster With First End-to-End Smart Wi-Fi Broadband Access System

SiGe’s 2.4GHz PA and GPS Receiver IC Voted Leading Products at EDN China Innovation Awards 2009

Molex Expands RF Capabilities with Zhenjiang Tean Telecom & Appliance Acquisition

Qualcomm Now Sampling Dual-carrier HSPA+ and Multi-Mode 3G/LTE Chipsets

   
 
Product News
   

Altium Adds Support for Xilinx Spartan-6 FPGA to Altium Designer

IR's IR11672A SmartRectifier IC Targeted at AC/DC Power Converters

Simultaneous-sampling ADC Provides "True" 16-bit Performance for Polyphase Power-grid Designs

Microchip's 18-pin PIC MCUs Feature Enhanced Mid-range Core

Atmel's Cortex-M3-based Flash MCUs Improve Impedance Matching, Lower Power Up to 50%

   
 
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.