Click to navigate back to homepage  
Sunday, March 21, 2010 
  Search :



 
 
     
 
 
Top News > Jun 2009
 
 

USB Market Will Get SuperSpeed Boost After Slower 2009

(Top News, 25 Jun 2009)


Although the global recession will prompt a slight decline in USB-enabled device shipments this year, next-generation “SuperSpeed” technology will fuel the market over the next several years, according to market research In-Stat. SuperSpeed, USB’s new incarnation, will deliver 5Gbps, a ten-fold improvement over high-speed USB. With the late 2008 introduction of SuperSpeed, the question is not whether it will be successful, but how successful it will be.

“All PCs, and most PC peripherals have transitioned from full-speed to high-speed. Most of these devices will eventually transition to SuperSpeed, the only issue is the speed of the transition.” says Brian O’Rourke, In-Stat analyst. “For PC peripheral devices, the key will be how quickly SuperSpeed is integrated into the application-specific integrated circuits (ASICs) and microcontrollers that are the brains of these devices.”

Recent research by In-Stat found the following:
- With over three billion devices shipped in 2008 alone, USB is the most successful interface ever. It has been broadly adopted across PCs, PC peripherals, consumer electronics (CE), communications and automotive devices.
- Consumer electronics devices with USB will rise at a 6.6 percent compound annual growth rate (CAGR) between 2008 and 2013.
- Although mini-USB ports have not made significant progress as a connector on mobile phones, micro-USB ports are expected to become the dominant standard for connectors in mobile phones by 2013.
- USB in computer mice will remain the single highest volume PC peripheral category.
- SuperSpeed USB will represent over 25 percent of the USB market by 2013.

 
 
 
 
Related Articles
   

Broadcom Crystal HD Technology Brings HD Multimedia Experience to Atom-based Netbook Platforms

Intel Atom Integrates Graphics, Memory Controller for Netbooks

Nokia, ST-Ericsson to Partner on TD-SCDMA

Atmel's Cortex-M3-based Flash MCUs Improve Impedance Matching, Lower Power Up to 50%

Microchip's 18-pin PIC MCUs Feature Enhanced Mid-range Core

NEC Electronics, Renesas Sign Merger Agreement

Freescale Sees Growth in Smart Mobile Devices

Wireless LAN Market Topped $1B in 3Q09

Video Surveillance Market a Mixed Opportunity for Semicon Providers

Digi, Qualcomm to Promote Wireless M2M Designs Incorporating Gobi Technology

   
 
Top News
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Anritsu Intros First Bluetooth Low Energy Test Solution

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Motorola Leads Fast-rebounding WiMAX Equipment and Device Market

   
 
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.