Click to navigate back to homepage  
Tuesday, March 16, 2010 
  Search :



 
 
     
 
 
Issue > Sep 2009 > Whats Hot
 
 

Solution for Eliminating Connector Congestion

( 1 Sep 2009 )


Intersil Corp. has introduced two new switches that provide the industry's optimal solution for eliminating congestion in handheld device connectors. The ISL54214 dual SP3T (single pole/triple throw) switch or 3:1 Mux combines low distortion audio and two accurate USB 2.0 high speed data (480Mbps) signal switching paths in the same low voltage device. The switches enable use of a common mini USB or audio headphone connector in media players and other portable battery-operated products by allowing either two USB transceivers or one USB transceiver ─ plus a UART transceiver ─ to share pins with an audio codec. The audio switch cells in both switches can pass ±1V ground referenced audio signals with ultra low distortion of <0.03 percent THD+N when driving 5mW into 32Ω headphone loads. They have a special muting mode of operation to provide very high isolation between the codec and the headphone or amplifier load. The USB switch cells have very low ON capacitance of just 8pF, resulting in high bandwidth to move USB high speed signals with minimal edge and phase distortion. Dual USB 2.0 data paths allow multiple chips to share a high speed USB port. Both devices incorporate failsafe power-off protection to prevent USB lock-up or battery drain via USB ports in case of power failure. COM pins in each version can tolerate over voltages beyond the supply rails, meeting USB short circuit requirements with no additional components.

Intersil Corp.
www.intersil.com

 
 
 
 
Related Articles
   

Telstra Increases Content and Mobile Data Revenues with SurfKitchen Powered Mobile User Interface

Elan Digital Releases USB-to-SDIO Host Bridge Chip

Avago Technologies Ramps Up Production of its QSFP+ Active Optical Cable and Transceiver Solutions

C&K Develops Comprehensive Range of Smart Card Connectors for Mobile, PoS and GPS Applications

C&K Develops Comprehensive Range of Smart Card Connectors for Mobile, PoS and GPS Applications

Fibre to Coax in One Complete Package

TI Releases Passive Low Frequency Interface with Battery Charge Function

Freescale mini USB Interface IC Enables a Single Connection for Mobile Device Charging, Audio and Data

TEWS Technologies Introduces FPGA-Based 4 Channel High Speed Synch/Asynch Serial Interface

Digi Core Module Speeds Development of Low Power Wireless Multimedia Devices

   
 
Top News
   

Verizon’s $17 Billion Network Investment in 2009 Pays Off

Anritsu Intros First Bluetooth Low Energy Test Solution

Nokia, ST-Ericsson to Partner on TD-SCDMA

Xilinx Connectivity, Embedded, and DSP Kits Enable Increased Productivity, Innovation for SoC Designs

Motorola Leads Fast-rebounding WiMAX Equipment and Device Market

   
 
 
 
 
Industry Links
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
   
   
 
 
 
 
 


 
 
Technical Channels

Amplifiers

Components

Digital Hardware/components

Integrated components

Integrated subsystems

Interface/interconect

Materials

Passives

Power

Semis/ICs/Mmics

Services

Signal Processing

Signal Sources

Software

Test & Measurement

Transmission Components

Wireless Protocols

 
Other Websites
EDN Asia
EDN Asia (India)
EDN Asia (Taiwan)
EDN Asia (Korea)
ECN Asia
ECN Asia (Korea)
ECN Asia (Taiwan)
  ECN Asia (China)
  EB Asia
Electronics Asia
Reed Electronic Group
Reed Business Information Asia
   
 

© 2010 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.